No photo of Dusan Sekulic
Calculated based on number of publications stored in Pure and citations from Scopus
1978 …2023

Research activity per year

Network

Fathima Badurdeen, Ph.D.

Person

Peng He

  • Harbin Institute of Technology

External person

Tiesong Lin

  • Harbin Institute of Technology

External person

Wen Liu

  • University of Kentucky

External person

Timothy G. Gutowski

  • Massachusetts Institute of Technology
  • MIT School of Engineering

External person

S. Dj Mesarovic

  • Washington State University Pullman
  • Washington State University

External person

M. D. Krivilyov

  • KU Leuven
  • Udmurt State University
  • RAS - Udmurt Federal Research Center, Ural Branch

External person

H. Zhao

  • University of Kentucky
  • Creative Thermal Solutions, Inc.

External person

C. N. Yu

  • University of Kentucky
  • Creative Thermal Solutions
  • Creative Thermal Solutions, Inc.

External person

Yulong Li

  • Nanchang University
  • University of Kentucky
  • Harbin Institute of Technology

External person

Y. Y. Qian

  • Harbin Institute of Technology

External person

Hai Fu

  • University of Kentucky

External person

F. Gao

  • Osaka University
  • University of Kentucky
  • Harbin Institute of Technology

External person

Daniel Busbaher

  • Ceradyne, Inc., A 3M Company
  • A 3M Company
  • Ceradyne Inc.
  • Semicon Associates
  • 3M
  • 3M Technical Ceramics

External person

Panpan Lin

  • Harbin Institute of Technology

External person

Yangyang Wu

  • University of Kentucky

External person

Bhavik R. Bakshi

  • The Energy and Resources Institute India
  • Ohio State University
  • The Ohio State University

External person

Rui Pan

  • Harbin Institute of Technology
  • University of Kentucky
  • Massachusetts Institute of Technology
  • Tsinghua University
  • MIT School of Engineering

External person

B. S. Baclic

  • University of Novi Sad

External person

H. Q. Wang

  • South China University of Technology
  • Harbin Institute of Technology
  • University of Kentucky

External person

Konstantinos Lazaridis

  • Washington State University Pullman
  • University of California Irvine
  • Washington State University
  • University of California

External person

Hongmei Wei

  • Harbin Institute of Technology

External person

Antonio Campo

  • Idaho State University
  • University of Tennessee, Knoxville
  • Marquette University

External person

C. V. Herman

  • Technical University Munich
  • University of Novi Sad
  • Carnegie Mellon University

External person

L. Walker

  • Oak Ridge National Laboratory

External person

Huijie Liu

  • Harbin Institute of Technology

External person

Yanying Hu

  • Harbin Institute of Technology

External person

Robert J. Krane

  • University of Tennessee, Knoxville
  • University of Novi Sad

External person

Xin Ma

  • Hiroshima University
  • Harbin Institute of Technology

External person

D. K. Hawksworth

  • Diomedea Inc.
  • SAPA Heat Transfer

External person

Guangjie Feng

  • Harbin Institute of Technology
  • University of Maryland, College Park

External person

Zhihua Yang

  • Harbin Institute of Technology

External person

R. K. Shah

  • Motors Corporation Lockport
  • Delphi Harrison Thermal Systems
  • University of Kentucky

External person

Zhuoran Li

  • Harbin Institute of Technology

External person

Benjamin P. Zellmer

  • Marquette University
  • Electrical and Computer Engineering, Marquette University

External person

Michael R. Zachariah

  • University of Maryland, College Park
  • University of Maryland

External person

Shuye Zhang

  • Harbin Institute of Technology

External person

B. B. Mikic

  • Massachusetts Institute of Technology
  • Carnegie Mellon University

External person

D. H. Richardson

  • Marquette University
  • University of Maryland, College Park
  • Electrical and Computer Engineering, Marquette University

External person

Jinlong Yang

  • Nanjing University of Aeronautics and Astronautics
  • University of Kentucky

External person

Y. L. Zhuang

  • Harbin Institute of Technology

External person

Shuaishuai Du

  • Harbin Institute of Technology

External person

Jicai Feng

  • Harbin Institute of Technology

External person

F. Mayinger

  • Technical University Munich
  • Carnegie Mellon University

External person

M. Dehsara

  • Washington State University Pullman
  • Washington State University

External person

Yong Yang

  • University of Maryland, College Park

External person

Alissa J. Jones

  • Massachusetts Institute of Technology
  • MIT School of Engineering

External person

Zhi Zhou

  • Harbin Institute of Technology

External person

D. C. Jia

  • Harbin Institute of Technology

External person

Z. Uzelac

  • University of Novi Sad

External person

Sasa Kovacevic

  • Washington State University Pullman
  • Washington State University

External person

Robert Bickel

  • University of Kentucky

External person

Wei Guo

  • Harbin Institute of Technology

External person

Songbai Xue

  • Nanjing University of Aeronautics and Astronautics

External person

Zhao Huang

  • Harbin Institute of Technology

External person

Yuguang Cai

  • University of Kentucky

External person

C. H. Amon

  • Carnegie Mellon University

External person

L. V. Kamaeva

  • RAS - Udmurt Federal Research Center, Ural Branch

External person

Maoai Chen

  • Shandong University

External person

F. J. Edeskuty

  • Los Alamos National Laboratory

External person

Xiaowu Hu

  • Nanchang University

External person

D. D. Gvozdenac

  • University of Novi Sad

External person

Cheng Zhao

  • Nanchang University

External person

Abraham J. Salazar

  • University of Kentucky

External person

F. Yoshida

  • Hiroshima University

External person

Helmut Koch

  • University of Kentucky

External person

D. Majumdar

  • Carnegie Mellon University

External person

I. V. Shutov

  • Udmurt State University
  • RAS - Udmurt Federal Research Center, Ural Branch

External person

P. K. Galenko

  • German Aerospace Center

External person

Dinesh Reddy Nalagatla

  • University of Kentucky

External person

Bradley D. Butler

  • University of Kentucky

External person

Michael Winter

  • University of Kentucky

External person

Matthew S. Branham

  • Massachusetts Institute of Technology
  • MIT School of Engineering

External person

Juan C. Morales

  • University of Texas
  • Universidad Simón Bolívar
  • University of Tennessee, Knoxville
  • University of Texas at Austin
  • University of Texas at Austin

External person

Nicholas Nigro

  • Marquette University
  • Electrical and Computer Engineering, Marquette University

External person

S. J. Wang

  • Harbin Institute of Technology

External person

Adrian Bejan

  • Duke University

External person

A. Zbrozek

  • University of Kentucky

External person

Enrico Sciubba

  • University of Rome La Sapienza

External person

Mengyuan Zhao

  • Harbin Institute of Technology

External person

Alexandre Thiriez

  • Massachusetts Institute of Technology
  • MIT School of Engineering

External person

Tong Wang

  • Harbin Institute of Technology

External person

A. E. Shapiro

  • Titanium Brazing, Inc.

External person

Hui Zhao

  • Creative Thermal Solutions, Inc.

External person

Yuanning Jiang

  • Shandong University

External person

Jiujie Xu

  • Harbin Institute of Technology

External person

Dmitry S. Samsonov

  • Udmurt State University

External person

Noam Lior

  • University of Pennsylvania

External person

Wanqi Zhao

  • Harbin Institute of Technology

External person

Bingzhi Wu

  • Harbin Institute of Technology

External person

Lingbo Lu

  • University of Kentucky

External person

Santhosh K.Muniyal Krishna

  • Washington State University Pullman
  • Washington State University

External person

Michael C. Wilder

  • NASA Ames Research Center

External person

Jorge Ramos-Grez

  • Pontificia Universidad Católica de Chile

External person

Rohit J. Jacob

  • University of Maryland, College Park
  • University of Maryland

External person

Hui Zhao

  • University of Kentucky

External person

Sheng Jiang

  • Massachusetts Institute of Technology

External person

Daniel Cooper

  • University of Michigan, Ann Arbor

External person

Xiao Shan

  • Shanghai Jiao Tong University

External person

T. Preuss

  • Excel Laboratory Services

External person

Signe Kjelstrup

  • Norwegian University of Science and Technology

External person

M. D. Krivilev

  • Udmurt State University
  • RAS - Udmurt Federal Research Center, Ural Branch

External person

Qinghua Feng

  • Harbin Institute of Technology

External person

Charles Bennett

  • IBM T.J. Watson Research Lab.
  • IBM

External person

Tom Henninger

  • University of Kentucky

External person

David Mocher

  • University of Kentucky

External person

Z. S. Milosevic

  • University of Novi Sad

External person

Hui Zhao

  • University of Kentucky

External person

Michael Schwindel

  • University of Kentucky

External person

Rahul Nehete

  • University of Kentucky

External person

Xiaoquan Qi

  • Harbin Institute of Technology

External person

Ziyang Xiu

  • Harbin Institute of Technology

External person

Xingxing Wang

  • Harbin Institute of Technology

External person

Yujie Sun

  • Nanchang University

External person

Evgeniy Voroshilov

  • Udmurt State University

External person

Xin Ping Zhang

  • South China University of Technology

External person

Fei Long

  • Harbin Institute of Technology

External person

Subramaniam Saiganesh

  • University of Kentucky

External person

Yan Liu

  • CAS - Shanghai Institute of Ceramics

External person

Shu Guo

  • Harbin Institute of Technology

External person

Jianhao Xu

  • Harbin Institute of Technology

External person

Ronghua Hu

  • Nanchang University

External person

Chao Dou

  • Harbin Institute of Technology

External person

Bingxuan Zhu

  • Harbin Institute of Technology

External person

Sam Miller

  • Sandia Natl Lab
  • Sandia National Laboratory

External person

Jayasankar Sankara

  • University of Kentucky

External person

Xiao Rong Wang

  • Lanzhou Jiaotong University
  • Harbin Institute of Technology

External person

Hui Zhao

  • University of Kentucky

External person

Bob Gregory

  • University of Kentucky

External person

Timo Schudeleit

  • Institute for Particle Physics and Astrophysics
  • Swiss Federal Institute of Technology Zurich

External person

Hui Zhao

  • University of Kentucky

External person

Maochang Wang

  • Harbin Institute of Technology

External person

A. Pignotti

  • Fundacion para el Desarrollo Tecnologico

External person

Miroslav Grmela

  • Polytechnique Montreal

External person

Yanxu Shen

  • Huawei Technologies Co., Ltd.

External person

Gian Paolo Beretta

  • University of Brescia

External person

Jeffrey B. Dahmus

  • Massachusetts Institute of Technology
  • MIT School of Engineering

External person

John Y.H. Liow

  • Massachusetts Institute of Technology

External person

J. G. Morris

  • University of Kentucky

External person

H. Zhao

  • University of Kentucky

External person

Zhao Qin Wang

  • Lanzhou University of Technology

External person

Qianqian Chen

  • Harbin Institute of Technology

External person

Eric D. Schneider

  • Hawkwood Institute

External person

Konrad Wegener

  • Institute for Particle Physics and Astrophysics
  • Swiss Federal Institute of Technology Zurich

External person

E. Leone

  • Excel Laboratory Services

External person

Adam Brown

  • University of Kentucky
  • Institute for Sustainable Manufacturing

External person

Changjin Wen

  • Nanchang University

External person

Ramesh K. Sha

  • Delphi Harrison Thermal Systems
  • Rochester Institute of Technology

External person

Yu Wang

  • Harbin Institute of Technology

External person

Huan Wang

  • Harbin Institute of Technology

External person

Ming Yan

  • Southern University of Science and Technology

External person

Zhao Hui

  • University of Kentucky

External person

F. Dong

  • University of Kentucky

External person

Miguel Rubi

  • University of Barcelona

External person

Matias Sabelle

  • Pontificia Universidad Católica de Chile

External person

Sha Li

  • Harbin Institute of Technology

External person

Bill Younga

  • University of Kentucky

External person

A. R. Khamidullina

  • Udmurt State University

External person

E. J. Becic

  • University of Novi Sad

External person

Jan Anders Manson

  • School of Life Sciences
  • Swiss Federal Institute of Technology Lausanne

External person

Zhan Sun

  • Harbin Institute of Technology

External person

I. Kmecko

  • University of Novi Sad

External person

A. Rabinkin

  • Brazing and Joining Consultant, LLC

External person

Jiandong Wang

  • Harbin Institute of Technology

External person

Zhuomin Zhang

  • Georgia Institute of Technology

External person

Michael J. Moran

  • Ohio State University
  • The Ohio State University

External person

Xuan Zhao

  • Harbin Institute of Technology

External person

Gero Corman

  • RTWH Aachen University

External person

Shulei Wang

  • Harbin Institute of Technology

External person

Di Gao

  • Harbin Institute of Technology

External person

David Jou

  • Autonomous University of Barcelona (UAB)

External person

Seth Lloyd

  • Massachusetts Institute of Technology

External person

Xiaoming Duan

  • Harbin Institute of Technology

External person

Svetlana A. Gruzd

  • Udmurt State University
  • Kalashnikov Izhevsk State Technical University

External person

Xiang Zhou

  • Harbin Institute of Technology

External person

Hui Zhao

  • University of Kentucky

External person

Yaroslav Chudnovsky

  • Gas Technology Institute

External person

Jian Yang

  • University of Science and Technology Beijing

External person

Michael Hausmann

  • School of Life Sciences
  • Swiss Federal Institute of Technology Lausanne

External person

Xiao Yu

  • Nanchang University

External person

Santhosh K. Muniyal Krishna

  • Washington State University

External person

Elias P. Gyftopoulos

  • Massachusetts Institute of Technology

External person

Qiyue Wang

  • University of Kentucky
  • Harbin Institute of Technology
  • Hebei University of Science and Technology

External person

Chun Xu Pan

  • University of Kentucky
  • Wuhan University
  • Wuhan University of Technology

External person

Chonglai Jiang

  • Harbin Institute of Technology

External person

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