Grants and Contracts Details
Description
Traditional JOIning technologies involve metallurgical bonds formed by adding distinct
filler/clad materials (as in the case of state-of-the-art brazing and soldering for mass
production manufacturing). If multiple joints must be formed simultaneously, these
technologies are characterized with a spatially uniformly distributed, i.e., not-necessarily
localized thermal energy delivery. Regardless of whether such materials processing is to be
accomplished in a tightly controlled atmosphere, vacuum or atmospheric conditions, the
related thermal interactions involve gradual heating on the macro scale. These processes are
notoriously energy-non efficient and often environmentally demanding. In addition,
significant thermal non uniformities may often compromise the joint integrity. Dramatic
improvement of the efficiency of such processes would be possible only if a localized but
spatially distributed energy release at multiple joint locations can be secured simultaneously,
not sequentially. Due to a complex architecture of mating surfaces and the nature of thermal
energy release (by radiation and/or convection) this task is impossible to accomplish using
traditional technologies.
In this proposal, it is hypothesized that such an objective can be accomplished by using an
electromagnetic tield if a selective thermal energy interaction between mating surfaces and
an active fixture tliat participates in energy release can be facilitated and controlled. This
energy release will be triggered and maintained through interaction of a microwave field and
a susceptor (say SiC) in the matrix of the fixture (e.g., alumina). The fundamental problem is
how to control the localized energy release simultaneously at different physical scales (from
nano to macro length scales). This problem will be solved through spatially distributed
dielectric susceptor imbedded in an insulator matrix. The distribution of the susceptor
follows the topology of the joint or a pre-determined pattern of the required energy release.
Such approach has not been attempted in existing applications of microwave heating.
The project is devoted to an investigation of the plausibility of this novel technology for
bonding highly conducting metals (such as metals, e.g., aluminum), and other materials.
Experimental verification of the approach and numerical modeling aimed at the
characterization of materials' processing (e.i. joint formation) will be offered.
Status | Finished |
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Effective start/end date | 6/1/04 → 7/31/05 |
Funding
- KY Science and Technology Co Inc: $14,935.00
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