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KSEF RDE: Characterization of Metallic Tin Whiskers in Lead-Free Solders
Yang, Fuqian
(PI)
Nychka, John
(Former PI)
Chemical and Materials Engineering
Overview
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Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.
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Weight
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Engineering
Tin
100%
Electronics
100%
Lead-Free Solder
100%
Failure (Mechanical)
50%
Gas Fuel Manufacture
50%
Microelectronics
50%
Solder
50%
Service Condition
50%
Economic Loss
25%
Networks (Circuits)
25%
Applications
25%
Mechanisms
25%
Microstructure
25%
Electronics Industry
25%
Kinetic
25%
Economic Potential
25%
Design
25%
Simulation
25%
Interconnection
25%
Research
25%
Models
25%
Material Science
Nanoelectronics
100%
Lead-Free Solder
100%
Characterization
100%
Soldering Alloys
75%
Mechanical Stress
50%
Solution
25%
Material
25%
Devices
25%
Electronic Materials
25%
Nucleation
25%
Microstructure
25%
Electronic Circuit
25%