Grants and Contracts Details
The Research and Development proposed herein will improve the operating characteristics of traditional rolling-element bearings and the applications to which they contribute through the development and application of MEMS/microstructures in two major categories. First, we will develop low-cost MEMS strain-sensing modules and the means to rapidly bond them to steel and other structures in large quantities. In addition to wire-based solutions, we will also develop modules for wireless data telemetry and power coupling to enable total systems-level solutions for the MEMS sensor modules. This will open the door toward providing low-cost load sensing for many applications. Second, we will explore the use of microstructures to improve heat transfer and lubrication phenomena to decrease friction and improve bearing life.
|Effective start/end date||6/1/02 → 5/31/05|
- University of California Berkeley: $570,149.00
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