A comparative study of reactive wetting of lead and lead-free solders on cu and (Cu 6Sn 5/Cu 3Sn)/Cu substrates

Hongqin Wang; Hui Zhao; Dusan P. Sekulic; Yiyu Qian

doi:10.1007/s11664-008-0502-8

A comparative study of reactive wetting of lead and lead-free solders on cu and (Cu ₆Sn ₅/Cu ₃Sn)/Cu substrates

Hongqin Wang, Hui Zhao, Dusan P. Sekulic, Yiyu Qian

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Abstract

Reactive wetting of solders on Cu and Cu ₆Sn ₅/Cu ₃Sn/Cu substrates was investigated using both (1) the wetting balance, and (2) the hot-stage real time, in situ visualization of the triple-line movement. To understand the phenomenology of the spreading behavior better, comprehensive real-time in situ observations were performed. It was found that the wetting time during the wetting balance tests for both the lead solder (63SnPb) and lead-free solder systems (Sn0.7Cu and Sn3.5Ag) is shorter on Cu substrates than it is on Cu ₆Sn ₅/Cu ₃Sn/Cu substrates. The wetting force was not remarkably different on these two substrates for the same solder system. The hot-stage tests indicate a more pronounced spreading of 63Sn-Pb on Cu ₆Sn ₅/Cu ₃Sn/Cu substrates, along with a much larger spreading area. Spreading of lead-free solders in terms of the triple-line kinetics studied by using the hot-stage visualization shows no significant difference in the spreading evolution either over Cu or over Cu ₆Sn ₅/Cu ₃Sn/Cu substrates.

Original language	English
Pages (from-to)	1640-1647
Number of pages	8
Journal	Journal of Electronic Materials
Volume	37
Issue number	10
DOIs	https://doi.org/10.1007/s11664-008-0502-8
State	Published - Oct 2008

Bibliographical note

Funding Information:
This work has been funded through a grant from Kentucky Science and Engineering Foundation (Grant Nos. KSEF-829-RDE-007 and KSEF-1490-RDE-010). One of the authors (H. Wang) acknowledges the visiting scholarship support from the University of Kentucky Center for Manufacturing.

Keywords

Bonding
Intermetallics
Lead-free solders
Wetting

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Materials Chemistry
Electrical and Electronic Engineering

Access to Document

10.1007/s11664-008-0502-8

Cite this

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title = "A comparative study of reactive wetting of lead and lead-free solders on cu and (Cu 6Sn 5/Cu 3Sn)/Cu substrates",

abstract = "Reactive wetting of solders on Cu and Cu 6Sn 5/Cu 3Sn/Cu substrates was investigated using both (1) the wetting balance, and (2) the hot-stage real time, in situ visualization of the triple-line movement. To understand the phenomenology of the spreading behavior better, comprehensive real-time in situ observations were performed. It was found that the wetting time during the wetting balance tests for both the lead solder (63SnPb) and lead-free solder systems (Sn0.7Cu and Sn3.5Ag) is shorter on Cu substrates than it is on Cu 6Sn 5/Cu 3Sn/Cu substrates. The wetting force was not remarkably different on these two substrates for the same solder system. The hot-stage tests indicate a more pronounced spreading of 63Sn-Pb on Cu 6Sn 5/Cu 3Sn/Cu substrates, along with a much larger spreading area. Spreading of lead-free solders in terms of the triple-line kinetics studied by using the hot-stage visualization shows no significant difference in the spreading evolution either over Cu or over Cu 6Sn 5/Cu 3Sn/Cu substrates.",

keywords = "Bonding, Intermetallics, Lead-free solders, Wetting",

author = "Hongqin Wang and Hui Zhao and Sekulic, {Dusan P.} and Yiyu Qian",

note = "Funding Information: This work has been funded through a grant from Kentucky Science and Engineering Foundation (Grant Nos. KSEF-829-RDE-007 and KSEF-1490-RDE-010). One of the authors (H. Wang) acknowledges the visiting scholarship support from the University of Kentucky Center for Manufacturing.",

year = "2008",

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doi = "10.1007/s11664-008-0502-8",

language = "English",

volume = "37",

pages = "1640--1647",

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T1 - A comparative study of reactive wetting of lead and lead-free solders on cu and (Cu 6Sn 5/Cu 3Sn)/Cu substrates

AU - Wang, Hongqin

AU - Zhao, Hui

AU - Sekulic, Dusan P.

AU - Qian, Yiyu

N1 - Funding Information: This work has been funded through a grant from Kentucky Science and Engineering Foundation (Grant Nos. KSEF-829-RDE-007 and KSEF-1490-RDE-010). One of the authors (H. Wang) acknowledges the visiting scholarship support from the University of Kentucky Center for Manufacturing.

PY - 2008/10

Y1 - 2008/10

N2 - Reactive wetting of solders on Cu and Cu 6Sn 5/Cu 3Sn/Cu substrates was investigated using both (1) the wetting balance, and (2) the hot-stage real time, in situ visualization of the triple-line movement. To understand the phenomenology of the spreading behavior better, comprehensive real-time in situ observations were performed. It was found that the wetting time during the wetting balance tests for both the lead solder (63SnPb) and lead-free solder systems (Sn0.7Cu and Sn3.5Ag) is shorter on Cu substrates than it is on Cu 6Sn 5/Cu 3Sn/Cu substrates. The wetting force was not remarkably different on these two substrates for the same solder system. The hot-stage tests indicate a more pronounced spreading of 63Sn-Pb on Cu 6Sn 5/Cu 3Sn/Cu substrates, along with a much larger spreading area. Spreading of lead-free solders in terms of the triple-line kinetics studied by using the hot-stage visualization shows no significant difference in the spreading evolution either over Cu or over Cu 6Sn 5/Cu 3Sn/Cu substrates.

AB - Reactive wetting of solders on Cu and Cu 6Sn 5/Cu 3Sn/Cu substrates was investigated using both (1) the wetting balance, and (2) the hot-stage real time, in situ visualization of the triple-line movement. To understand the phenomenology of the spreading behavior better, comprehensive real-time in situ observations were performed. It was found that the wetting time during the wetting balance tests for both the lead solder (63SnPb) and lead-free solder systems (Sn0.7Cu and Sn3.5Ag) is shorter on Cu substrates than it is on Cu 6Sn 5/Cu 3Sn/Cu substrates. The wetting force was not remarkably different on these two substrates for the same solder system. The hot-stage tests indicate a more pronounced spreading of 63Sn-Pb on Cu 6Sn 5/Cu 3Sn/Cu substrates, along with a much larger spreading area. Spreading of lead-free solders in terms of the triple-line kinetics studied by using the hot-stage visualization shows no significant difference in the spreading evolution either over Cu or over Cu 6Sn 5/Cu 3Sn/Cu substrates.

KW - Bonding

KW - Intermetallics

KW - Lead-free solders

KW - Wetting

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