The applicability of peridynamic models to problems with irregularly non-uniformly discretized solution domain is critical. In this study, a systematic comparison study on results predicted using eight different peridynamic models, including bond-based, ordinary state-based and non-ordinary state-based mechanics and heat conduction models, for three different types of mechanical problems, including thermal, mechanics and coupled thermo-mechanics, with irregular non-uniform spatial discretization is performed. It is found that for the case of irregular but semi-uniform spatial discretization, all these models yield good predictions compared to analytical local solutions. For the case of irregular and non-uniform spatial discretization, models formulated specifically for this configuration give much better results than the conventional formulations which do not consider the neighborhood difference among material points in the spatial discretization. For either cases of spatial discretization, the bond-associated correspondence material model predicts the most accurate results.
|Number of pages||16|
|Journal||Computer Methods in Applied Mechanics and Engineering|
|State||Published - Mar 1 2019|
Bibliographical noteFunding Information:
This work wassupported through the INL Laboratory Directed Research & Development (LDRD) Program under DOE Idaho Operation Office Contract DE-AC07-05ID14517 . This manuscript has been authored by Battelle Energy Alliance, LLC under Contract No. DE-AC07-05ID14517 with the U.S. Department of Energy. The United States Government retains and the publisher, by accepting the article for publication, acknowledges that the United States Government retains a nonexclusive, paid-up, irrevocable, world-wide license to publish or reproduce the published form of this manuscript, or allow others to do so, for United States Government purposes.
© 2018 Elsevier B.V.
- Bond-based models
- Correspondence models
- Irregular spatial discretization
- State-based models
ASJC Scopus subject areas
- Computational Mechanics
- Mechanics of Materials
- Mechanical Engineering
- Physics and Astronomy (all)
- Computer Science Applications