A Semi-Analytical Method to Predict Printed Circuit Board Package Temperatures

John N. Funk; M. Pinar Mengüç; Kaveh A. Tagavi; Clifford J. Cremers

doi:10.1109/33.180030

A Semi-Analytical Method to Predict Printed Circuit Board Package Temperatures

John N. Funk, M. Pinar Mengüç, Kaveh A. Tagavi, Clifford J. Cremers

Mechanical and Aerospace Engineering

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

Abstract

In this paper, a quick, easy-to-use method is developed to predict steady-state temperatures on printed circuit boards (PCB's) subjected to heating by single or multiple heat sources. The method includes separate analytical solutions for the circuit board and for the chips to be mounted on the board. The board solution is developed using the Green's function method for solving the heat diffusion equation in the board. For the chip, the solution of the heat diffusion equation is obtained using the method of separation of variables. The temperature solution for the package is determined using an iterative procedure between the chip model and the board model. The accuracy of the method is verified by comparison with detailed finite element techniques.

Original language	English
Pages (from-to)	675-684
Number of pages	10
Journal	IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Volume	15
Issue number	5
DOIs	https://doi.org/10.1109/33.180030
State	Published - Oct 1992

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
General Engineering
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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abstract = "In this paper, a quick, easy-to-use method is developed to predict steady-state temperatures on printed circuit boards (PCB's) subjected to heating by single or multiple heat sources. The method includes separate analytical solutions for the circuit board and for the chips to be mounted on the board. The board solution is developed using the Green's function method for solving the heat diffusion equation in the board. For the chip, the solution of the heat diffusion equation is obtained using the method of separation of variables. The temperature solution for the package is determined using an iterative procedure between the chip model and the board model. The accuracy of the method is verified by comparison with detailed finite element techniques.",

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N2 - In this paper, a quick, easy-to-use method is developed to predict steady-state temperatures on printed circuit boards (PCB's) subjected to heating by single or multiple heat sources. The method includes separate analytical solutions for the circuit board and for the chips to be mounted on the board. The board solution is developed using the Green's function method for solving the heat diffusion equation in the board. For the chip, the solution of the heat diffusion equation is obtained using the method of separation of variables. The temperature solution for the package is determined using an iterative procedure between the chip model and the board model. The accuracy of the method is verified by comparison with detailed finite element techniques.

AB - In this paper, a quick, easy-to-use method is developed to predict steady-state temperatures on printed circuit boards (PCB's) subjected to heating by single or multiple heat sources. The method includes separate analytical solutions for the circuit board and for the chips to be mounted on the board. The board solution is developed using the Green's function method for solving the heat diffusion equation in the board. For the chip, the solution of the heat diffusion equation is obtained using the method of separation of variables. The temperature solution for the package is determined using an iterative procedure between the chip model and the board model. The accuracy of the method is verified by comparison with detailed finite element techniques.

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A Semi-Analytical Method to Predict Printed Circuit Board Package Temperatures

Abstract

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