TY - GEN
T1 - A thermodynamic framework for analyzing and improving manufacturing processes
AU - Branham, Matthew
AU - Gutowski, Timothy G.
AU - Jones, Alissa
AU - Sekulic, Dusan P.
PY - 2008
Y1 - 2008
N2 - In this paper, we present the formulation of a framework for the quantitative thermodynamic analysis of manufacturing processes and systems. Since manufacturing typically involves the input of high-quality material/energy and/or dissipation of low-quality energy/waste to manipulate a material, an approach that combines both the first and the second laws of thermodynamics is appropriate. This formulation helps emphasize that the improvement of manufacturing processes and systems is more a question of both utilizing the quantity and conserving the quality of energy than merely conserving energy. We conclude with two examples of its application, the first a comparison of metal casting technologies and the second a contrast between high-throughput CNC machining and a slower process rate grinding operation.
AB - In this paper, we present the formulation of a framework for the quantitative thermodynamic analysis of manufacturing processes and systems. Since manufacturing typically involves the input of high-quality material/energy and/or dissipation of low-quality energy/waste to manipulate a material, an approach that combines both the first and the second laws of thermodynamics is appropriate. This formulation helps emphasize that the improvement of manufacturing processes and systems is more a question of both utilizing the quantity and conserving the quality of energy than merely conserving energy. We conclude with two examples of its application, the first a comparison of metal casting technologies and the second a contrast between high-throughput CNC machining and a slower process rate grinding operation.
KW - Exergy
KW - Manufacturing
KW - Thermodynamics
UR - http://www.scopus.com/inward/record.url?scp=51849128862&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=51849128862&partnerID=8YFLogxK
U2 - 10.1109/ISEE.2008.4562892
DO - 10.1109/ISEE.2008.4562892
M3 - Conference contribution
AN - SCOPUS:51849128862
SN - 1424422728
SN - 9781424422722
T3 - IEEE International Symposium on Electronics and the Environment
BT - 2008 16th IEEE International Symposium on Electronics and the Environment, ISEE
T2 - 2008 16th IEEE International Symposium on Electronics and the Environment, ISEE
Y2 - 19 May 2008 through 22 May 2008
ER -