Acquiring a 2-D rolled equivalent fingerprint image from a non-contact 3-D finger scan

Abhishika Fatehpuria, Daniel L. Lau, Laurence G. Hassebrook

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

30 Scopus citations

Abstract

The use of fingerprints as a biometric is both the oldest mode of computer aided personal identification and the most relied-upon technology in use today. But current fingerprint scanning systems have some challenging and peculiar difficulties. Often skin conditions and imperfect acquisition circumstances cause the captured fingerprint image to be far from ideal. Also some of the acquisition techniques can be slow and cumbersome to use and may not provide the complete information required for reliable feature extraction and fingerprint matching. Most of the difficulties arise due to the contact of the fingerprint surface with the sensor platen. To attain a fast-capture, non-contact, fingerprint scanning technology, we are developing a scanning system that employs structured light illumination as a means for acquiring a 3-D scan of the finger with sufficiently high resolution to record ridge-level details. In this paper, we describe the post-processing steps used for converting the acquired 3-D scan of the subject's finger into a 2-D rolled equivalent image.

Original languageEnglish
Title of host publicationBiometric Technology for Human Identification III
DOIs
StatePublished - 2006
EventBiometric Technology for Human Identification III - Kissimmee, FL, United States
Duration: Apr 17 2006Apr 18 2006

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6202
ISSN (Print)0277-786X

Conference

ConferenceBiometric Technology for Human Identification III
Country/TerritoryUnited States
CityKissimmee, FL
Period4/17/064/18/06

Keywords

  • 3-D fingerprints
  • Biometrics
  • Fingerprint acquisition
  • Fingerprint image post-processing
  • Springs algorithm
  • Weighted least squares

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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