Adhesion of screen printed conductors on laser reduced AlN

S. Gopalakrishnan, Janet K. Lumpp

Research output: Contribution to journalConference articlepeer-review

Abstract

Aluminum Nitride (AlN) has not attained the type of success alumina has had with thick film materials. This project is aimed at increasing the number of thick film inks compatible with AlN. Excimer laser reduced AlN is metallic, but not sufficiently conductive to act as an interconnection for microelectronic circuits. The reduced surface acts as a bonding layer to promote adhesion of screen printed metal films. Design of Experiments (DOE) plays a critical role in determining the success of a research project. Completely Randomized Nested Classification design strategy is used in these experiments. The Ag-Pd ink formulated for alumina is screen printed on AlN and alumina substrates in a random order and fired. Wires are soldered to the pads and a pull test is done. Analysis of Variance (ANOVA) is used to compare the adhesion strength of Ag-Pd ink formulated for alumina screen printed on Al2O3 and laser reduced AlN substrates.

Original languageEnglish
Pages (from-to)263-268
Number of pages6
JournalMaterials Research Society Symposium Proceedings
Volume390
DOIs
StatePublished - 1995
EventProceedings of the Spring Meeting on MRS - San Francisco, CA, USA
Duration: Apr 17 1995Apr 20 1995

ASJC Scopus subject areas

  • Materials Science (all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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