An integrated computational framework for microstructure-sensitive materials modeling

Hailong Chen; Yang Jiao; Yongming Liu

doi:10.2514/6.2019-0691

An integrated computational framework for microstructure-sensitive materials modeling

Hailong Chen, Yang Jiao, Yongming Liu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

An integrated computational framework for microstructure-sensitive materials modeling is presented. The general formulation of the integrated computational framework is discussed. Details on microstructure generation and microstructure-based mechanical modeling are provided. Following this, microstructure-sensitive mechanical analyses are performed on bicontinuous microstructures to assess their mechanical properties. Results are compared with analytical solution. Good agreements are found.

Original language	English
Title of host publication	AIAA Scitech 2019 Forum
DOIs	https://doi.org/10.2514/6.2019-0691
State	Published - 2019
Event	AIAA Scitech Forum, 2019 - San Diego, United States Duration: Jan 7 2019 → Jan 11 2019

Publication series

Name	AIAA Scitech 2019 Forum

Conference

Conference	AIAA Scitech Forum, 2019
Country/Territory	United States
City	San Diego
Period	1/7/19 → 1/11/19

Bibliographical note

Publisher Copyright:
© 2019, American Institute of Aeronautics and Astronautics Inc, AIAA. All rights reserved.

ASJC Scopus subject areas

Aerospace Engineering

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10.2514/6.2019-0691

Cite this

@inproceedings{766285835c0243258fc085232085676e,

title = "An integrated computational framework for microstructure-sensitive materials modeling",

abstract = "An integrated computational framework for microstructure-sensitive materials modeling is presented. The general formulation of the integrated computational framework is discussed. Details on microstructure generation and microstructure-based mechanical modeling are provided. Following this, microstructure-sensitive mechanical analyses are performed on bicontinuous microstructures to assess their mechanical properties. Results are compared with analytical solution. Good agreements are found.",

author = "Hailong Chen and Yang Jiao and Yongming Liu",

note = "Publisher Copyright: {\textcopyright} 2019, American Institute of Aeronautics and Astronautics Inc, AIAA. All rights reserved.; AIAA Scitech Forum, 2019 ; Conference date: 07-01-2019 Through 11-01-2019",

year = "2019",

doi = "10.2514/6.2019-0691",

language = "English",

isbn = "9781624105784",

series = "AIAA Scitech 2019 Forum",

booktitle = "AIAA Scitech 2019 Forum",

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TY - GEN

T1 - An integrated computational framework for microstructure-sensitive materials modeling

AU - Chen, Hailong

AU - Jiao, Yang

AU - Liu, Yongming

PY - 2019

Y1 - 2019

N2 - An integrated computational framework for microstructure-sensitive materials modeling is presented. The general formulation of the integrated computational framework is discussed. Details on microstructure generation and microstructure-based mechanical modeling are provided. Following this, microstructure-sensitive mechanical analyses are performed on bicontinuous microstructures to assess their mechanical properties. Results are compared with analytical solution. Good agreements are found.

AB - An integrated computational framework for microstructure-sensitive materials modeling is presented. The general formulation of the integrated computational framework is discussed. Details on microstructure generation and microstructure-based mechanical modeling are provided. Following this, microstructure-sensitive mechanical analyses are performed on bicontinuous microstructures to assess their mechanical properties. Results are compared with analytical solution. Good agreements are found.

UR - http://www.scopus.com/inward/record.url?scp=85083944795&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85083944795&partnerID=8YFLogxK

U2 - 10.2514/6.2019-0691

DO - 10.2514/6.2019-0691

M3 - Conference contribution

AN - SCOPUS:85083944795

SN - 9781624105784

T3 - AIAA Scitech 2019 Forum

BT - AIAA Scitech 2019 Forum

T2 - AIAA Scitech Forum, 2019

Y2 - 7 January 2019 through 11 January 2019

ER -

An integrated computational framework for microstructure-sensitive materials modeling

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus subject areas

Access to Document

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