An Orthotropic Thermal Conductivity Measurement in Flexible, Fibrous Insulation Materials

James D. Senig, John F. Maddox

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A testing apparatus has been developed to help characterize the thermal conductivity of fibrous insulation materials. The goal of this apparatus is to measure the in-plane thermal conductivity of thermal protection systems (TPS) materials along with the through-the-thickness thermal conductivity. Previous experiments have focused on characterizing and modeling the through-the-thickness thermal conductivity of TPS materials. Very few experiments, if any, have characterized and modeled the in-plane thermal conductivity as a function of temperature, pressure, and gaseous composition. The in-plane thermal conductivity of fibrous insulation materials such as PICA or its substrate FiberForm® is estimated to be 2–3 times higher than their respective through-the-thickness thermal conductivities. Due to this difference, the in-plane thermal conductivity plays an important role in determining how incident heat fluxes are spread out along re-entry vehicles. The through-the-thickness and in-plane thermal conductivity of Pyrogel XTE, or Aerogel, was measured. It was found that the through-the-thickness thermal conductivity was 0.060 W/mK and the in-plane thermal conductivity was 0.265 W/mK.

Original languageEnglish
Title of host publicationAIAA SciTech Forum and Exposition, 2024
DOIs
StatePublished - 2024
EventAIAA SciTech Forum and Exposition, 2024 - Orlando, United States
Duration: Jan 8 2024Jan 12 2024

Publication series

NameAIAA SciTech Forum and Exposition, 2024

Conference

ConferenceAIAA SciTech Forum and Exposition, 2024
Country/TerritoryUnited States
CityOrlando
Period1/8/241/12/24

Bibliographical note

Publisher Copyright:
© 2024 by the American Institute of Aeronautics and Astronautics, Inc. All rights reserved.

ASJC Scopus subject areas

  • Aerospace Engineering

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