Analysis of microstrip structures of finite ground plane using the hybrid volume-surface integral equation approach

Cai Cheng Lu, Chun Yu

Research output: Contribution to journalConference articlepeer-review

5 Scopus citations

Abstract

A hybrid volume-surface integral equation (VSIE) approach for fast and accurate simulation of microstrip structures is presented. Compared with previous simulation approaches of printed structures, the VSIE approach presents a number of advantages. Hence, it gives flexibility to model structures of real size and of non-flat, arbitrarily shaped substrate and ground planes.

Original languageEnglish
Pages (from-to)162-165
Number of pages4
JournalIEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
Volume4
StatePublished - 2002
Event2002 IEEE Antennas and Propagation Society International Symposium - San Antonio, TX, United States
Duration: Jun 16 2002Jun 21 2002

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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