Isotropic conductive adhesives (ICAs) filled with metal particles are commercially available as alternatives to solder joining in electronic packaging. Replacing metal fillers with multiwall carbon nanotubes (MWCNTs) offers the potential benefits of being corrosion resistant, high strength and lightweight. Traditional metal filled ICAs require high metal loading to ensure electrical conductivity, which may cause problems with respect to reliability and strength to weight ratio. The ultra-high aspect ratio and surface area of multiwall carbon nanotubes induce a low percolation threshold of less than 0.25 wt% in epoxy. MWCNTs dispersed in epoxy increase the thermal diffusivity of the polymer by a factor of 2 to 3 and decrease the volume resitivity to less than 10 Ω cm for loadings up to 12 wt%. Lap shear strength decreases with increased MWCNT loading. The dependences of electrical, thermal and mechanical properties on loading and aspect ratio of MWCNTs are reported, and the electrical conduction mechanism is discussed.
|Number of pages||13|
|Journal||Journal of Adhesion Science and Technology|
|State||Published - Sep 1 2008|
Bibliographical noteFunding Information:
This research was sponsored by Kentucky NASA EPSCoR and the Army Research Laboratory under Cooperative Agreement Number W911NF-04-2-0023. The views and conclusions contained in this document are those of the authors and should not be interpreted as representing the official policies, either expressed or implied, of the Army Research Laboratory or the US Government. The US Government is authorized to reproduce and distribute reprints for Government purposes notwithstanding any copyright notation hereon.
- Isotropic conductive adhesive
- Multiwall carbon nanotubes
- Percolation threshold
ASJC Scopus subject areas
- Chemistry (all)
- Mechanics of Materials
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Materials Chemistry