Balancing material and exergy flows for a PCB soldering process: Method and a case study

Subramaniam Saiganesh; Dusan P. Sekulic

doi:10.1109/ISSST.2010.5507708

Balancing material and exergy flows for a PCB soldering process: Method and a case study

Subramaniam Saiganesh, Dusan P. Sekulic

Mechanical and Aerospace Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

Use of thermodynamics metrics (e.g. exergy) as sustainability analysis tools offers an insight into energy resources use in both energy and non-energy technologies. This study is devoted to an analysis of material, energy and exergy flows along a manufacturing line of a PCB-based products' manufacturing operation. It is observed that a large quantity of available energy is inherently dissipated even if a state-of-the-art process is adopted. Drastic change in an approach towards developing new, transformational technologies are mandatory if a sustainable development is to be achieved through improvements of resources use. These changes may be guided by an insight obtained through thermodynamics metrics studies.

Original language	English
Title of host publication	Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010
DOIs	https://doi.org/10.1109/ISSST.2010.5507708
State	Published - 2010
Event	2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010 - Arlington, VA, United States Duration: May 17 2010 → May 19 2010

Publication series

Name	Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010

Conference

Conference	2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010
Country/Territory	United States
City	Arlington, VA
Period	5/17/10 → 5/19/10

Keywords

Exergy analysis
Manufacturing
PCB

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ISSST.2010.5507708

Cite this

Saiganesh, S., & Sekulic, D. P. (2010). Balancing material and exergy flows for a PCB soldering process: Method and a case study. In Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010 Article 5507708 (Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010). https://doi.org/10.1109/ISSST.2010.5507708

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title = "Balancing material and exergy flows for a PCB soldering process: Method and a case study",

abstract = "Use of thermodynamics metrics (e.g. exergy) as sustainability analysis tools offers an insight into energy resources use in both energy and non-energy technologies. This study is devoted to an analysis of material, energy and exergy flows along a manufacturing line of a PCB-based products' manufacturing operation. It is observed that a large quantity of available energy is inherently dissipated even if a state-of-the-art process is adopted. Drastic change in an approach towards developing new, transformational technologies are mandatory if a sustainable development is to be achieved through improvements of resources use. These changes may be guided by an insight obtained through thermodynamics metrics studies.",

keywords = "Exergy analysis, Manufacturing, PCB",

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language = "English",

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note = "2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010 ; Conference date: 17-05-2010 Through 19-05-2010",

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Saiganesh, S & Sekulic, DP 2010, Balancing material and exergy flows for a PCB soldering process: Method and a case study. in Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010., 5507708, Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010, 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010, Arlington, VA, United States, 5/17/10. https://doi.org/10.1109/ISSST.2010.5507708

Balancing material and exergy flows for a PCB soldering process: Method and a case study. / Saiganesh, Subramaniam; Sekulic, Dusan P.
Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010. 2010. 5507708 (Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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PY - 2010

Y1 - 2010

N2 - Use of thermodynamics metrics (e.g. exergy) as sustainability analysis tools offers an insight into energy resources use in both energy and non-energy technologies. This study is devoted to an analysis of material, energy and exergy flows along a manufacturing line of a PCB-based products' manufacturing operation. It is observed that a large quantity of available energy is inherently dissipated even if a state-of-the-art process is adopted. Drastic change in an approach towards developing new, transformational technologies are mandatory if a sustainable development is to be achieved through improvements of resources use. These changes may be guided by an insight obtained through thermodynamics metrics studies.

AB - Use of thermodynamics metrics (e.g. exergy) as sustainability analysis tools offers an insight into energy resources use in both energy and non-energy technologies. This study is devoted to an analysis of material, energy and exergy flows along a manufacturing line of a PCB-based products' manufacturing operation. It is observed that a large quantity of available energy is inherently dissipated even if a state-of-the-art process is adopted. Drastic change in an approach towards developing new, transformational technologies are mandatory if a sustainable development is to be achieved through improvements of resources use. These changes may be guided by an insight obtained through thermodynamics metrics studies.

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KW - Manufacturing

KW - PCB

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BT - Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010

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Saiganesh S, Sekulic DP. Balancing material and exergy flows for a PCB soldering process: Method and a case study. In Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010. 2010. 5507708. (Proceedings of the 2010 IEEE International Symposium on Sustainable Systems and Technology, ISSST 2010). doi: 10.1109/ISSST.2010.5507708

Balancing material and exergy flows for a PCB soldering process: Method and a case study

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