Abstract
Creep property of 90 Pb-10 Sn alloy was studied by using impression testing technique in a temperature range of 298-393 K and punching stress range of 17.1-102.8 MPa. Based on a power law between the impression velocity and the punching stress, a value of stress exponent 4.3 was obtained. A linear relation between the impression velocity and the punch diameter was observed, which is in agreement with the numerical simulation reported in the literature. The activation energy for the creep flow of 90 Pb-10 Sn alloy was found to be 46.7 kJ/mole, from which a single mechanism of interfacial sliding between two phases was proposed for the creep behavior of 90 Pb-10 Sn alloy.
| Original language | English |
|---|---|
| Pages (from-to) | 387-394 |
| Number of pages | 8 |
| Journal | Physica Status Solidi (A) Applied Research |
| Volume | 198 |
| Issue number | 2 |
| DOIs | |
| State | Published - Aug 2003 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics