Decomposition and permeability of room temperature vulcanizing (RTV) silicone

Luis Chacon, Ben Deaton, Savio J. Poovathingal

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Room temperature vulcanizing (RTV) silicone is used to join thermal protection system (TPS) tiles and attach the entire TPS system to the surface of space capsules. The RTV allows expansion and contraction from temperature changes during atmospheric entry, which avoids cracks in the brittle TPS tiles. Two types of RTV are heated to various temperatures at different heating rates in a high-temperature furnace and a thermogravimetric analyzer to understand the decomposition of RTV during entry of spacecrafts. X-ray computed tomography (XRCT) is used to create three-dimensional virtual volumes of the RTV material decomposed in a furnace. The volumes obtained from XRCT, and the mass loss curves from the thermogravimetric analyzer and the high-temperature furnace are used to understand the structure of RTV as it decomposes. It is found that RTV materials burn from the inside, creating cavities inside the material while pushing the exterior material outwards, and causing inelastic deformation of the RTV material. The two RTV samples decompose in different patterns depending on the heating rate, but the internal decomposition process is similar with both materials forming cavities, eventually resulting in a permeable material that allows gases to flow through them. It is found that the RTV is impermeable from temperatures between 200 to approximately 350 ◦C, where mass decomposition is not significant, and there is minimal decomposition of the material. However, after 350 ◦C, the mass loss and material decomposition significantly increases, making the RTV permeable. The three-dimensional volume of RTV obtained after heating to 600 ◦C is used as an input to compute the effective permeability of the decomposed RTV material.

Original languageEnglish
Title of host publicationAIAA SciTech Forum and Exposition, 2023
DOIs
StatePublished - 2023
EventAIAA SciTech Forum and Exposition, 2023 - Orlando, United States
Duration: Jan 23 2023Jan 27 2023

Publication series

NameAIAA SciTech Forum and Exposition, 2023

Conference

ConferenceAIAA SciTech Forum and Exposition, 2023
Country/TerritoryUnited States
CityOrlando
Period1/23/231/27/23

Bibliographical note

Publisher Copyright:
© 2023, American Institute of Aeronautics and Astronautics Inc, AIAA. All rights reserved.

Funding

This work was supported by a Space Technology Research Institutes grant from NASA\u2019s Space Technology Research Grants Program under grant number 80NSSC21K1117. We would also like to thank Dr. Matt Weisenberger from Center for Applied Energy Research (CAER) at the University of Kentucky for performing the TGA of the samples, and providing the TGA data. Additionally, support from the University of Kentucky Center for Computational Sciences and Information Technology Services Research Computing for their support and use of the Lipscomb Compute Cluster and associated research computing resources is acknowledged. This work was also performed in part at the U.K. Electron Microscopy Center, a member of the National Nanotechnology Coordinated Infrastructure (NNCI), which is supported by the National Science Foundation (NNCI- 2025075).

FundersFunder number
Kentucky Transportation Center, University of Kentucky
Center for Applied Energy Research
NASA80NSSC21K1117
National Science Foundation Arctic Social Science ProgramNNCI- 2025075
National Science Foundation Arctic Social Science Program

    ASJC Scopus subject areas

    • Aerospace Engineering

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