Abstract
Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.
Original language | English |
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Pages (from-to) | 191-210 |
Number of pages | 20 |
Journal | Journal of Materials Science: Materials in Electronics |
Volume | 18 |
Issue number | 1-3 |
DOIs | |
State | Published - Mar 2007 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Electrical and Electronic Engineering