Deformation behavior of tin and some tin alloys

Fuqian Yang, J. C.M. Li

Research output: Contribution to journalArticlepeer-review

64 Scopus citations

Abstract

Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.

Original languageEnglish
Pages (from-to)191-210
Number of pages20
JournalJournal of Materials Science: Materials in Electronics
Volume18
Issue number1-3
DOIs
StatePublished - Mar 2007

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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