Deformation behavior of tin and some tin alloys

Fuqian Yang; J. C.M. Li

doi:10.1007/978-0-387-48433-4_12

Deformation behavior of tin and some tin alloys

Fuqian Yang, J. C.M. Li

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

6 Scopus citations

Abstract

Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.

Original language	English
Title of host publication	Lead-Free Electronic Solders
Subtitle of host publication	A Special Issue of the Journal of Materials Science: Materials in Electronics
Pages	191-210
Number of pages	20
DOIs	https://doi.org/10.1007/978-0-387-48433-4_12
State	Published - 2007

ASJC Scopus subject areas

General Engineering

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10.1007/978-0-387-48433-4_12

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@inbook{62e13c5dcbe24ce8817147e835aa44b4,

title = "Deformation behavior of tin and some tin alloys",

abstract = "Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.",

author = "Fuqian Yang and Li, {J. C.M.}",

year = "2007",

doi = "10.1007/978-0-387-48433-4_12",

language = "English",

isbn = "0387484310",

pages = "191--210",

booktitle = "Lead-Free Electronic Solders",

}

TY - CHAP

T1 - Deformation behavior of tin and some tin alloys

AU - Yang, Fuqian

AU - Li, J. C.M.

PY - 2007

Y1 - 2007

N2 - Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.

AB - Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.

UR - http://www.scopus.com/inward/record.url?scp=84892782827&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84892782827&partnerID=8YFLogxK

U2 - 10.1007/978-0-387-48433-4_12

DO - 10.1007/978-0-387-48433-4_12

M3 - Chapter

AN - SCOPUS:84892782827

SN - 0387484310

SN - 9780387484310

SP - 191

EP - 210

BT - Lead-Free Electronic Solders

ER -

Deformation behavior of tin and some tin alloys

Abstract

ASJC Scopus subject areas

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