Deformation behavior of tin and some tin alloys

Fuqian Yang, J. C.M. Li

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

6 Scopus citations

Abstract

Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.

Original languageEnglish
Title of host publicationLead-Free Electronic Solders
Subtitle of host publicationA Special Issue of the Journal of Materials Science: Materials in Electronics
Pages191-210
Number of pages20
DOIs
StatePublished - 2007

ASJC Scopus subject areas

  • Engineering (all)

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