Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.
|Title of host publication||Lead-Free Electronic Solders|
|Subtitle of host publication||A Special Issue of the Journal of Materials Science: Materials in Electronics|
|Number of pages||20|
|State||Published - 2007|
ASJC Scopus subject areas
- Engineering (all)