Deformation behavior of tin and some tin alloys

Fuqian Yang; J. C.M. Li

doi:10.1007/978-0-387-48433-4_12

Deformation behavior of tin and some tin alloys

Fuqian Yang, J. C.M. Li

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

6 Scopus citations

Abstract

Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.

Original language	English
Title of host publication	Lead-Free Electronic Solders
Subtitle of host publication	A Special Issue of the Journal of Materials Science: Materials in Electronics
Pages	191-210
Number of pages	20
DOIs	https://doi.org/10.1007/978-0-387-48433-4_12
State	Published - 2007

ASJC Scopus subject areas

General Engineering

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10.1007/978-0-387-48433-4_12

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abstract = "Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.",

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Deformation behavior of tin and some tin alloys

Abstract

ASJC Scopus subject areas

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