Abstract
Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.
| Original language | English |
|---|---|
| Pages (from-to) | 191-210 |
| Number of pages | 20 |
| Journal | Journal of Materials Science: Materials in Electronics |
| Volume | 18 |
| Issue number | 1-3 |
| DOIs | |
| State | Published - Mar 2007 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Electrical and Electronic Engineering