Effect of electric current on nanoindentation of copper

Fuqian Yang, Guangfeng Zhao

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

The electromechanical behavior of electronic interconnects plays an important role in determining the reliability and lifetime of microelectromechanical devices and structures. Using the nanoindentation technique, the effect of electric current on the indentation deformation of copper wires was studied under the indentation load of 50 μN to 1000μN at room temperature. During the indentation, a constant direct electric current of the current density in the range of 6.4 to 31.8 kA/cm2 was passed through the copper wires, which introduced electromechanical interaction. The indentation results showed that the apparent contact modulus decreased with increasing electric current density and the apparent indentation hardness increased slightly with increasing electric current density. The decrease of the apparent contact modulus with increasing electric current density was likely due to the momentum exchange among high-speed electrons and atoms.

Original languageEnglish
Pages (from-to)322-326
Number of pages5
JournalNanoscience and Nanotechnology Letters
Volume2
Issue number4
DOIs
StatePublished - Dec 2010

Keywords

  • Electromechanical Interaction
  • Nanoindentation

ASJC Scopus subject areas

  • General Materials Science

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