Abstract
The electromechanical behavior of electronic interconnects plays an important role in determining the reliability and lifetime of microelectromechanical devices and structures. Using the nanoindentation technique, the effect of electric current on the indentation deformation of copper wires was studied under the indentation load of 50 μN to 1000μN at room temperature. During the indentation, a constant direct electric current of the current density in the range of 6.4 to 31.8 kA/cm2 was passed through the copper wires, which introduced electromechanical interaction. The indentation results showed that the apparent contact modulus decreased with increasing electric current density and the apparent indentation hardness increased slightly with increasing electric current density. The decrease of the apparent contact modulus with increasing electric current density was likely due to the momentum exchange among high-speed electrons and atoms.
Original language | English |
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Pages (from-to) | 322-326 |
Number of pages | 5 |
Journal | Nanoscience and Nanotechnology Letters |
Volume | 2 |
Issue number | 4 |
DOIs | |
State | Published - Dec 2010 |
Keywords
- Electromechanical Interaction
- Nanoindentation
ASJC Scopus subject areas
- General Materials Science