Abstract
An analysis was made of the diffusional creep in polycrystalline materials when subjected to simultaneous action of tensile stress and electric current. Incorporating the contribution of electromigration to atomic diffusion in grain boundaries, the problem of grain boundary diffusion was solved. A simple relationship was derived between diffusional creep rate and local electric field intensity (current density). The results showed that electromigration can enhance the diffusional creep in polycrystalline materials.
| Original language | English |
|---|---|
| Pages (from-to) | 165-171 |
| Number of pages | 7 |
| Journal | International Journal of Applied Electromagnetics and Mechanics |
| Volume | 40 |
| Issue number | 2 |
| DOIs | |
| State | Published - 2012 |
Keywords
- Electromigration
- diffusion creep
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering