Effects of annealing on microstructure of osmium-ruthenium thin films

W. C. Li, S. Roberts, T. J. Balk

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

Osmium-ruthenium (OsRu) thin films of different thickness were deposited on porous tungsten (W) pellets in a configuration similar to dispenser cathodes, using two separate sputtering systems. In order to assess which films may best inhibit interdiffusion between the OsRu film and the W substrate during annealing, the grain structure and texture of OsRu films were characterized by x-ray diffraction and scanning electron microscopy.

Original languageEnglish
Title of host publication2009 IEEE International Vacuum Electronics Conference, IVEC 2009
Pages177-178
Number of pages2
DOIs
StatePublished - 2009
Event2009 IEEE International Vacuum Electronics Conference, IVEC 2009 - Rome, Italy
Duration: Apr 28 2009Apr 30 2009

Publication series

Name2009 IEEE International Vacuum Electronics Conference, IVEC 2009

Conference

Conference2009 IEEE International Vacuum Electronics Conference, IVEC 2009
Country/TerritoryItaly
CityRome
Period4/28/094/30/09

Keywords

  • Microstructure
  • Osmium
  • Ruthenium
  • Thin film

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Fingerprint

Dive into the research topics of 'Effects of annealing on microstructure of osmium-ruthenium thin films'. Together they form a unique fingerprint.

Cite this