Abstract
Free abrasive machining (FAM) using a wiresaw is emerging as a state of the art technology for slicing large diameter semiconductor wafers. Material removal in a FAM environment is known to be by rolling and indenting of abrasives into the cut media. Therefore, indentation by abrasives in the slurry is the single most important mechanism in wiresawing process. This paper deals with the importance of abrasive shape in material removal during FAM. To achieve this objective, indentation by conical rigid abrasives of different included angles has been investigated using finite element method (FEM). Typical indentation fracture involving median, radial and transverse cracking has been explained to the maximum level of sophistication attainable using static stress analysis. Some industrially relevant results pertaining to FAM in general and wiresawing in particular have been proposed.
| Original language | English |
|---|---|
| Title of host publication | Manufacturing Science and Engineering |
| Pages | 819-824 |
| Number of pages | 6 |
| ISBN (Electronic) | 9780791816066 |
| DOIs | |
| State | Published - 1998 |
| Event | ASME 1998 International Mechanical Engineering Congress and Exposition, IMECE 1998 - Anaheim, United States Duration: Nov 15 1998 → Nov 20 1998 |
Publication series
| Name | ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) |
|---|---|
| Volume | 1998-R |
Conference
| Conference | ASME 1998 International Mechanical Engineering Congress and Exposition, IMECE 1998 |
|---|---|
| Country/Territory | United States |
| City | Anaheim |
| Period | 11/15/98 → 11/20/98 |
Bibliographical note
Publisher Copyright:© 1998 American Society of Mechanical Engineers (ASME). All rights reserved.
ASJC Scopus subject areas
- Mechanical Engineering