Electrically conductive adhesives are attractive alternatives to solder and die attach materials in electronic assemblies particularly in the lead free era. Compared to metal filled conductive adhesives, multiwall carbon nanotube (MWCNT) filled adhesives are lightweight, corrosion resistant, high strength and resistant to metal migration. Previous studies of MWCNT filled epoxies on bare copper printed circuit boards identified contact resistance as a challenge for surface mount component attachment. The adhesive formulations under investigation are mixtures of epoxy Epon resin 862, Heloxy modifier 68, anhydride curing agent, catalyst and MWCNT. Loadings ranging from 2 to 14 wt% are tested to determine electrical and mechanical properties. Here we present contact resistance, volume resistivity and lap shear testing of MWCNT filled epoxy on printed circuit boards with various surface finishes on the copper pads. The surface finishes selected are immersion tin, immersion silver and electroless nickel immersion gold (ENIG).