TY - GEN
T1 - Electrically conductive carbon nanotube adhesives on lead free printed circuit board surface finishes
AU - Mantena, Keerthivarma
AU - Li, Jing
AU - Lumpp, Janet K.
PY - 2008
Y1 - 2008
N2 - Electrically conductive adhesives are attractive alternatives to solder and die attach materials in electronic assemblies particularly in the lead free era. Compared to metal filled conductive adhesives, multiwall carbon nanotube (MWCNT) filled adhesives are lightweight, corrosion resistant, high strength and resistant to metal migration. Previous studies of MWCNT filled epoxies on bare copper printed circuit boards identified contact resistance as a challenge for surface mount components where pressure was required during curing to lower the average contact resistance. Currently, we are repeating contact resistance, volume resistivity, lap shear and die shear testing of CNT filled epoxy on printed circuit boards with various surface finishes on the copper pads. The surface finishes under investigation are immersion tin, immersion silver and electroless nickel-immersion gold (ENIG).
AB - Electrically conductive adhesives are attractive alternatives to solder and die attach materials in electronic assemblies particularly in the lead free era. Compared to metal filled conductive adhesives, multiwall carbon nanotube (MWCNT) filled adhesives are lightweight, corrosion resistant, high strength and resistant to metal migration. Previous studies of MWCNT filled epoxies on bare copper printed circuit boards identified contact resistance as a challenge for surface mount components where pressure was required during curing to lower the average contact resistance. Currently, we are repeating contact resistance, volume resistivity, lap shear and die shear testing of CNT filled epoxy on printed circuit boards with various surface finishes on the copper pads. The surface finishes under investigation are immersion tin, immersion silver and electroless nickel-immersion gold (ENIG).
UR - http://www.scopus.com/inward/record.url?scp=49349087853&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=49349087853&partnerID=8YFLogxK
U2 - 10.1109/AERO.2008.4526480
DO - 10.1109/AERO.2008.4526480
M3 - Conference contribution
AN - SCOPUS:49349087853
SN - 1424414881
SN - 9781424414888
T3 - IEEE Aerospace Conference Proceedings
BT - 2008 IEEE Aerospace Conference, AC
T2 - 2008 IEEE Aerospace Conference, AC
Y2 - 1 March 2008 through 8 March 2008
ER -