Electrochemical behavior of the T1(Al2CuLi) intermetallic compound and its role in localized corrosion of Al-2% Li-3% Cu alloys

R. G. Buchheit; J. P. Moran; G. E. Stoner

doi:10.5006/1.3293500

Electrochemical behavior of the T₁(Al₂CuLi) intermetallic compound and its role in localized corrosion of Al-2% Li-3% Cu alloys

R. G. Buchheit, J. P. Moran, G. E. Stoner

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Abstract

The T₁ (Al₂CuLi) intermetallic compound was synthesized in bulk form for characterization of its electrochemical behavior in chloride solutions by conventional direct current (DC) techniques. Results indicated T₁ was active with respect to its microstructural surroundings in artificially aged Aluminum Association (AA) 2090 (UNS A92090) (Al 2.1% Li-2.6% Cu) and preferential dissolution of T₁ precipitates strongly influenced localized corrosion behavior of the alloy. Subgrain boundaries in artificially aged AA 2090 were particularly susceptible to localized attack because of high concentrations of T₁. The role of T₁ in preferential subgrain boundary attack in a chloride-free sulfate solution also was investigated.

Original language	English
Pages	120-130
Number of pages	11
Volume	50
No	2
Specialist publication	Corrosion
DOIs	https://doi.org/10.5006/1.3293500
State	Published - 1994

ASJC Scopus subject areas

General Chemistry
General Chemical Engineering
General Materials Science

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PY - 1994

Y1 - 1994

N2 - The T1 (Al2CuLi) intermetallic compound was synthesized in bulk form for characterization of its electrochemical behavior in chloride solutions by conventional direct current (DC) techniques. Results indicated T1 was active with respect to its microstructural surroundings in artificially aged Aluminum Association (AA) 2090 (UNS A92090) (Al 2.1% Li-2.6% Cu) and preferential dissolution of T1 precipitates strongly influenced localized corrosion behavior of the alloy. Subgrain boundaries in artificially aged AA 2090 were particularly susceptible to localized attack because of high concentrations of T1. The role of T1 in preferential subgrain boundary attack in a chloride-free sulfate solution also was investigated.

AB - The T1 (Al2CuLi) intermetallic compound was synthesized in bulk form for characterization of its electrochemical behavior in chloride solutions by conventional direct current (DC) techniques. Results indicated T1 was active with respect to its microstructural surroundings in artificially aged Aluminum Association (AA) 2090 (UNS A92090) (Al 2.1% Li-2.6% Cu) and preferential dissolution of T1 precipitates strongly influenced localized corrosion behavior of the alloy. Subgrain boundaries in artificially aged AA 2090 were particularly susceptible to localized attack because of high concentrations of T1. The role of T1 in preferential subgrain boundary attack in a chloride-free sulfate solution also was investigated.

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Electrochemical behavior of the T₁(Al₂CuLi) intermetallic compound and its role in localized corrosion of Al-2% Li-3% Cu alloys

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