Electrochemical behavior of the T1(Al2CuLi) intermetallic compound and its role in localized corrosion of Al-2% Li-3% Cu alloys

R. G. Buchheit, J. P. Moran, G. E. Stoner

Research output: Contribution to specialist publicationArticle

126 Scopus citations

Abstract

The T1 (Al2CuLi) intermetallic compound was synthesized in bulk form for characterization of its electrochemical behavior in chloride solutions by conventional direct current (DC) techniques. Results indicated T1 was active with respect to its microstructural surroundings in artificially aged Aluminum Association (AA) 2090 (UNS A92090) (Al 2.1% Li-2.6% Cu) and preferential dissolution of T1 precipitates strongly influenced localized corrosion behavior of the alloy. Subgrain boundaries in artificially aged AA 2090 were particularly susceptible to localized attack because of high concentrations of T1. The role of T1 in preferential subgrain boundary attack in a chloride-free sulfate solution also was investigated.

Original languageEnglish
Pages120-130
Number of pages11
Volume50
No2
Specialist publicationCorrosion
DOIs
StatePublished - 1994

ASJC Scopus subject areas

  • Chemistry (all)
  • Chemical Engineering (all)
  • Materials Science (all)

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