Electrodeposition of palladium film on electroless Ni-P coatings supported by Si substrate

Xiang Gao, Dongyan Ding, Zhi Chen, Ming Li, Dali Mao

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A transition layer of Ni-P coating will help enhance the hydrogen sensing stability of Pd films supported by silicon wafers. In this work, Pd films were electrodeposited on electroless Ni-P coated silicon wafers. The effect of deposition parameters on the microstructure (especially the morphology) of Ni-P coatings and Pd films were investigated. Experimental results indicated that a lower pH value of electroless plating solution and a longer electroless plating time could increase the size of Ni-P nodular particles. In addition, the morphology of Pd films was shaped by the nanostructures of the Ni-P coating. An optimized Pd /Ni-P structures is expected to present good hydrogen sensing performance.

Original languageEnglish
Title of host publicationProceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
DOIs
StatePublished - 2007
Event2007 8th International Conference on Electronic Packaging Technology, ICEPT - Shanghai, China
Duration: Aug 14 2007Aug 17 2007

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference2007 8th International Conference on Electronic Packaging Technology, ICEPT
Country/TerritoryChina
CityShanghai
Period8/14/078/17/07

ASJC Scopus subject areas

  • General Engineering

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