TY - GEN
T1 - Electrodeposition of palladium film on electroless Ni-P coatings supported by Si substrate
AU - Gao, Xiang
AU - Ding, Dongyan
AU - Chen, Zhi
AU - Li, Ming
AU - Mao, Dali
PY - 2007
Y1 - 2007
N2 - A transition layer of Ni-P coating will help enhance the hydrogen sensing stability of Pd films supported by silicon wafers. In this work, Pd films were electrodeposited on electroless Ni-P coated silicon wafers. The effect of deposition parameters on the microstructure (especially the morphology) of Ni-P coatings and Pd films were investigated. Experimental results indicated that a lower pH value of electroless plating solution and a longer electroless plating time could increase the size of Ni-P nodular particles. In addition, the morphology of Pd films was shaped by the nanostructures of the Ni-P coating. An optimized Pd /Ni-P structures is expected to present good hydrogen sensing performance.
AB - A transition layer of Ni-P coating will help enhance the hydrogen sensing stability of Pd films supported by silicon wafers. In this work, Pd films were electrodeposited on electroless Ni-P coated silicon wafers. The effect of deposition parameters on the microstructure (especially the morphology) of Ni-P coatings and Pd films were investigated. Experimental results indicated that a lower pH value of electroless plating solution and a longer electroless plating time could increase the size of Ni-P nodular particles. In addition, the morphology of Pd films was shaped by the nanostructures of the Ni-P coating. An optimized Pd /Ni-P structures is expected to present good hydrogen sensing performance.
UR - http://www.scopus.com/inward/record.url?scp=50249161877&partnerID=8YFLogxK
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U2 - 10.1109/ICEPT.2007.4441492
DO - 10.1109/ICEPT.2007.4441492
M3 - Conference contribution
AN - SCOPUS:50249161877
SN - 1424413923
SN - 9781424413928
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
BT - Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
T2 - 2007 8th International Conference on Electronic Packaging Technology, ICEPT
Y2 - 14 August 2007 through 17 August 2007
ER -