TY - GEN
T1 - Electrodeposition of palladium films on Ni-Co coatings
AU - He, Yanping
AU - Ding, Dongyan
AU - Gao, Xiang
AU - Chen, Zhi
AU - Li, Ming
AU - Mao, Dali
PY - 2008
Y1 - 2008
N2 - Co-Ni alloys have the properties of high hardness, good wear and corrosion resistance. A transition layer of Co-Ni coating will help enhance the hydrogen sensing stability of Pd films. In this work, Pd films were electrodeposited on Co-Ni coated copper substrate and silicon wafers. The influence of deposition parameters on the microstructure of Co-Ni coatings and Pd films were investigated. Experimental results indicated that scallop shell-like Co-Ni alloys could be fabricated on copper wafers. The tendency to form the shell-like deposits increased with increase of deposition time. While on silicon wafers, scallop shell-like Co-Ni alloys could not be fabricated. SEM and AFM analyses indicated that both composite films have a large surface area. Results showed that Pd films could be shaped by the prime films and thus maintain a large surface area.
AB - Co-Ni alloys have the properties of high hardness, good wear and corrosion resistance. A transition layer of Co-Ni coating will help enhance the hydrogen sensing stability of Pd films. In this work, Pd films were electrodeposited on Co-Ni coated copper substrate and silicon wafers. The influence of deposition parameters on the microstructure of Co-Ni coatings and Pd films were investigated. Experimental results indicated that scallop shell-like Co-Ni alloys could be fabricated on copper wafers. The tendency to form the shell-like deposits increased with increase of deposition time. While on silicon wafers, scallop shell-like Co-Ni alloys could not be fabricated. SEM and AFM analyses indicated that both composite films have a large surface area. Results showed that Pd films could be shaped by the prime films and thus maintain a large surface area.
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U2 - 10.1109/ICEPT.2008.4607048
DO - 10.1109/ICEPT.2008.4607048
M3 - Conference contribution
AN - SCOPUS:52449103835
SN - 9781424427406
T3 - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
BT - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
T2 - 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
Y2 - 28 July 2008 through 31 July 2008
ER -