Experimental characterization and modeling of dynamic behavior of semi-rigid thin film polyimide panels

Jonathan T. Black, Suzanne Weaver Smith, Jack Leifer, Larry Bradford

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Stiff, ultra-lightweight thermal-formed polyimide panels considered here are examples of next generation gossamer structures that resolve some of the technology barriers of previous, membrane-dominated gossamer designs while maintaining their low mass and low stowage volume characteristics. The research involved dynamically characterizing and modeling several of these panels to develop validated computer models which can be used to determine the effects of changing manufacturing parameters and scalability. Modal testing extracted the first four structural natural frequencies, the first occurring at 71.9 Hz. These data were replicated by simple, coarsely-meshed shell element finite element models that are significantly smaller than previous finite element models of similar structures. Overall, the research contributes to the total knowledge base of gossamer technologies, advances stiff panel-based structures toward space qualification, and demonstrates their potential for use in apertures and other spacecraft.

Original languageEnglish
Title of host publicationCollection of Technical Papers - 48th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
Pages1542-1563
Number of pages22
StatePublished - 2007
Event48th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference - Waikiki, HI, United States
Duration: Apr 23 2007Apr 26 2007

Publication series

NameCollection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
Volume2
ISSN (Print)0273-4508

Conference

Conference48th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
Country/TerritoryUnited States
CityWaikiki, HI
Period4/23/074/26/07

ASJC Scopus subject areas

  • Architecture
  • General Materials Science
  • Aerospace Engineering
  • Mechanics of Materials
  • Mechanical Engineering

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