Experimental observations of twin formation during thermal annealing of nanocrystalline copper films using orientation mapping

Paul F. Rottmann, Kevin J. Hemker

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

This study employed a TEM-based automated crystal orientation mapping technique that enables orientation mapping with nanoscale spatial resolution. This nanoscale orientation mapping technique was employed to study thermally-assisted grain growth and to quantify the attendant formation of nanotwins and twin junctions in nanocrystalline Cu. The grain size increased from 29 ± 14 nm to 57 ± 22 nm and the fraction of twin-containing grains increased from 0.18 to 0.70. Close inspection of the twins and twin junctions captured within orientation maps documented a frequency of junctions that was remarkably consistent with previous molecular dynamics predictions.

Original languageEnglish
Pages (from-to)76-79
Number of pages4
JournalScripta Materialia
Volume141
DOIs
StatePublished - Dec 2017

Bibliographical note

Publisher Copyright:
© 2017 Acta Materialia Inc.

Keywords

  • Annealing twin
  • Grain growth
  • Nanocrystalline materials
  • Orientation mapping
  • Thin films

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

Fingerprint

Dive into the research topics of 'Experimental observations of twin formation during thermal annealing of nanocrystalline copper films using orientation mapping'. Together they form a unique fingerprint.

Cite this