Experimental results for a heat-sink mechanical seal

Matthew A. Hayden, Lyndon Scott Stephens

Research output: Contribution to journalArticlepeer-review


This work presents experimental results for a heat-sink mechanical seal installed in a I × 1.5 × 6 in. ANSI centrifugal waterpump. The heat-sink seal is constructed of a stainless steel substrate with an electrodeposited pin fin micro-heat sink located within 3 mm of the end face. Each pin has a ten-sided polygon cross section with a flat-to-flat diameter of 675 μm, a height of 856 μm, and a 300-μm edge-to-edge spacing. The end face is coated with a WC thin film that forms the wear surface for the rotating ring. The heat-sink seal's effectiveness is demonstrated in a significant reduction of both the seal interface and seal chamber temperature when compared to a similar industry standard seal. The heat-sink seal removes 750 W of heat and reduces the stationary ring temperature by 80°C under dead-head conditions using only 1.6 W of coolant pumping power.

Original languageEnglish
Pages (from-to)352-361
Number of pages10
JournalTribology Transactions
Issue number3
StatePublished - Jul 2005

Bibliographical note

Funding Information:
The authors wish to thank the Defense Advanced Research Projects Agency for their support under contract DABT63-99-1-0019 and the U.S. Department of Education for their support of this work under the GAANN Fellowship Program. Additionally, the authors extend their gratitude to K.W. Kelly of Louisiana State University for providing the heat sink seal stationary rings.


  • Centrifugal pump
  • Mechanical seal
  • Pin fin heat sink

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films


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