Finite element analysis of the indentation-induced delamination of Bi-layer structures

Ming Liu, Fuqian Yang

Research output: Contribution to journalArticlepeer-review

19 Scopus citations


Contact deformation can cause local damage of mechanical structures and lead to structural failure of mechanical devices. In this work, we use the finite element method to analyze the indentationinduced delamination of a film-substrate structure and the critical tensile stress as the criterion to determine local delamination on the interface between the film and the substrate. The simulation results show that both the size of the delamination zone and the maximum separation increase with increasing the indentation depth and with decreasing the film thickness. The delamination also depends on the interfacial friction for the sliding on the interface. The largest delamination occurs at the friction coefficient of 0.5 for the film-substrate structure used in this work. For friction coefficient larger than 0.5, the size of the delamination zone decreases with increasing the friction coefficient.

Original languageEnglish
Pages (from-to)851-858
Number of pages8
JournalJournal of Computational and Theoretical Nanoscience
Issue number6
StatePublished - 2012


  • Delamination
  • Film
  • Finite element analysis
  • Indentation
  • Interface

ASJC Scopus subject areas

  • Chemistry (all)
  • Materials Science (all)
  • Condensed Matter Physics
  • Computational Mathematics
  • Electrical and Electronic Engineering


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