Abstract
Electron-beam induced deposition of high-purity copper nanostructures is desirable for nanoscale rapid prototyping, interconnection of chemically synthesized structures, and integrated circuit editing. However, metalorganic, gas-phase precursors for copper introduce high levels of carbon contamination. Here we demonstrate electron beam induced deposition of high-purity copper nanostructures from aqueous solutions of copper sulfate. The addition of sulfuric acid eliminates oxygen contamination from the deposit and produces a deposit with ∼95 at% copper. The addition of sodium dodecyl sulfate (SDS), Triton X-100, or polyethylene glycole (PEG) improves pattern resolution and controls deposit morphology but leads to slightly reduced purity. High resolution nested lines with a 100 nm pitch are obtained from CuSO4-H2SO4-SDS-H2O. Higher aspect ratios (∼1:1) with reduced line edge roughness and unintended deposition are obtained from CuSO4-H2SO4-PEG-H2O. Evidence for radiation-chemical deposition mechanisms was observed, including deposition efficiency as high as 1.4 primary electrons/Cu atom.
Original language | English |
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Article number | 125301 |
Journal | Nanotechnology |
Volume | 28 |
Issue number | 12 |
DOIs | |
State | Published - Feb 21 2017 |
Bibliographical note
Publisher Copyright:© 2017 IOP Publishing Ltd.
Keywords
- FEBID
- copper deposition
- direct write nanofabrication
- electron beam induced process
- liquid phase
ASJC Scopus subject areas
- Bioengineering
- General Chemistry
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering