Focused electron beam induced etching of copper in sulfuric acid solutions

Lindsay Boehme, Matthew Bresin, Aurélien Botman, James Ranney, J. Todd Hastings

Research output: Contribution to journalArticlepeer-review

6 Scopus citations


We show here that copper can be locally etched by an electron-beam induced reaction in a liquid. Aqueous sulfuric acid (H2SO4) is utilized as the etchant and all experiments are conducted in an environmental scanning electron microscope. The extent of etch increases with liquid thickness and dose, and etch resolution improves with H2SO4 concentration. This approach shows the feasibility of liquid phase etching for material selectivity and has the potential for circuit editing.

Original languageEnglish
Article number495301
Issue number49
StatePublished - Nov 16 2015

Bibliographical note

Publisher Copyright:
© 2015 IOP Publishing Ltd.


  • circuit edit
  • copper
  • e-beam induced etching
  • etch selectivity
  • liquid phase electron-beam induced processing
  • sulfuric acid

ASJC Scopus subject areas

  • Bioengineering
  • General Chemistry
  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering


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