High performance infiltrant-free cryogenic machining of 82% density porous tungsten under computer numerical control

Julius Schoop; I. S. Jawahir; T. John Balk; Daniel Busbaher

doi:10.1109/IVEC.2014.6857543

High performance infiltrant-free cryogenic machining of 82% density porous tungsten under computer numerical control

Julius Schoop, I. S. Jawahir, T. John Balk, Daniel Busbaher

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

Cryogenic machining was used as a means to eliminate the conventional methyl-methacrylate infiltration process used in the manufacture of dispenser cathode matrices. The resulting surfaces were analyzed before and after impregnation to determine their suitability for dispenser cathodes.

Original language	English
Title of host publication	IEEE International Vacuum Electronics Conference, IVEC 2014
Pages	167-168
Number of pages	2
DOIs	https://doi.org/10.1109/IVEC.2014.6857543
State	Published - 2014
Event	15th IEEE International Vacuum Electronics Conference, IVEC 2014 - Monterey, CA, United States Duration: Apr 22 2014 → Apr 24 2014

Publication series

Name	IEEE International Vacuum Electronics Conference, IVEC 2014

Conference

Conference	15th IEEE International Vacuum Electronics Conference, IVEC 2014
Country/Territory	United States
City	Monterey, CA
Period	4/22/14 → 4/24/14

Keywords

cryogenic machining
dispenser cathode
porous tungsten
surface integrity

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/IVEC.2014.6857543

Cite this

Schoop, J., Jawahir, I. S., Balk, T. J., & Busbaher, D. (2014). High performance infiltrant-free cryogenic machining of 82% density porous tungsten under computer numerical control. In IEEE International Vacuum Electronics Conference, IVEC 2014 (pp. 167-168). Article 6857543 (IEEE International Vacuum Electronics Conference, IVEC 2014). https://doi.org/10.1109/IVEC.2014.6857543

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title = "High performance infiltrant-free cryogenic machining of 82% density porous tungsten under computer numerical control",

abstract = "Cryogenic machining was used as a means to eliminate the conventional methyl-methacrylate infiltration process used in the manufacture of dispenser cathode matrices. The resulting surfaces were analyzed before and after impregnation to determine their suitability for dispenser cathodes.",

keywords = "cryogenic machining, dispenser cathode, porous tungsten, surface integrity",

author = "Julius Schoop and Jawahir, {I. S.} and Balk, {T. John} and Daniel Busbaher",

year = "2014",

doi = "10.1109/IVEC.2014.6857543",

language = "English",

isbn = "9781467301879",

series = "IEEE International Vacuum Electronics Conference, IVEC 2014",

pages = "167--168",

booktitle = "IEEE International Vacuum Electronics Conference, IVEC 2014",

note = "15th IEEE International Vacuum Electronics Conference, IVEC 2014 ; Conference date: 22-04-2014 Through 24-04-2014",

}

Schoop, J , Jawahir, IS , Balk, TJ & Busbaher, D 2014, High performance infiltrant-free cryogenic machining of 82% density porous tungsten under computer numerical control. in IEEE International Vacuum Electronics Conference, IVEC 2014., 6857543, IEEE International Vacuum Electronics Conference, IVEC 2014, pp. 167-168, 15th IEEE International Vacuum Electronics Conference, IVEC 2014, Monterey, CA, United States, 4/22/14. https://doi.org/10.1109/IVEC.2014.6857543

High performance infiltrant-free cryogenic machining of 82% density porous tungsten under computer numerical control. / Schoop, Julius ; Jawahir, I. S.; Balk, T. John et al.
IEEE International Vacuum Electronics Conference, IVEC 2014. 2014. p. 167-168 6857543 (IEEE International Vacuum Electronics Conference, IVEC 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - High performance infiltrant-free cryogenic machining of 82% density porous tungsten under computer numerical control

AU - Schoop, Julius

AU - Jawahir, I. S.

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Y1 - 2014

N2 - Cryogenic machining was used as a means to eliminate the conventional methyl-methacrylate infiltration process used in the manufacture of dispenser cathode matrices. The resulting surfaces were analyzed before and after impregnation to determine their suitability for dispenser cathodes.

AB - Cryogenic machining was used as a means to eliminate the conventional methyl-methacrylate infiltration process used in the manufacture of dispenser cathode matrices. The resulting surfaces were analyzed before and after impregnation to determine their suitability for dispenser cathodes.

KW - cryogenic machining

KW - dispenser cathode

KW - porous tungsten

KW - surface integrity

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High performance infiltrant-free cryogenic machining of 82% density porous tungsten under computer numerical control

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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