TY - GEN
T1 - High temperature braze flow control during manufacturing of dispenser cathodes
AU - Busbaher, Daniel
AU - Sekulic, Dusan P.
PY - 2008
Y1 - 2008
N2 - The study has been performed to explore undesired flow of a Mo-Ni braze filler metal over Mo-Re heat shields substrate during manufacturing of dispenser cathodes. The ultimate goal was to develop an optimal design to help control the flow of the braze material and still satisfy other requirements, such as a uniform heat transfer, structural stability, functionality, as well as requirements with respect to quality, reliability, and durability. This paper presents brief results of the series of tests featuring uncontrollable filler metal spreading during brazing. Several related issues have been studied and results will be addressed. Improved designs will be proposed and compared with existing ones using a qualitative evaluation of a design of a brazed structure recently proposed.
AB - The study has been performed to explore undesired flow of a Mo-Ni braze filler metal over Mo-Re heat shields substrate during manufacturing of dispenser cathodes. The ultimate goal was to develop an optimal design to help control the flow of the braze material and still satisfy other requirements, such as a uniform heat transfer, structural stability, functionality, as well as requirements with respect to quality, reliability, and durability. This paper presents brief results of the series of tests featuring uncontrollable filler metal spreading during brazing. Several related issues have been studied and results will be addressed. Improved designs will be proposed and compared with existing ones using a qualitative evaluation of a design of a brazed structure recently proposed.
KW - Braze joint design
KW - Dispenser cathode
KW - Filler metal spreading
UR - http://www.scopus.com/inward/record.url?scp=51349087203&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=51349087203&partnerID=8YFLogxK
U2 - 10.1109/IVELEC.2008.4556522
DO - 10.1109/IVELEC.2008.4556522
M3 - Conference contribution
AN - SCOPUS:51349087203
SN - 1424417155
SN - 9781424417155
T3 - 2008 IEEE International Vacuum Electronics Conference, IVEC with 9th IEEE International Vacuum Electron Sources Conference, IVESC
SP - 342
EP - 343
BT - 2008 IEEE International Vacuum Electronics Conference, IVEC with 9th IEEE International Vacuum Electron Sources Conference, IVESC
T2 - 2008 IEEE International Vacuum Electronics Conference, IVEC with 9th IEEE International Vacuum Electron Sources Conference, IVESC
Y2 - 22 April 2008 through 24 April 2008
ER -