High temperature brazing of porous tungsten with nano structured Mo-Ni for a dispenser cathode application

Daniel Busbaher, Wen Liu, David Mocher, Dusan P. Sekulic

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

This paper offers an insight into a comprehensive study of liquid nano-composite braze filler spreading during bonding of porous tungsten to molybdenum. The considered application involves structural elements of a dispenser cathode. A new formulation of Mo-Ni filler doped with SiC nano-particles has been analyzed. The study involves a high temperature brazing in controlled atmosphere (N2+H2). The performed studies include DSC/TG analysis of nano-composites, SEM and EDS analyses of the re-solidified filler, the hot stage microscopy tests in real time and in situ, and microprobe studies of the liquid metal penetration into the tungsten porous matrix.

Original languageEnglish
Title of host publication2011 IEEE International Vacuum Electronics Conference, IVEC-2011
Pages323-324
Number of pages2
DOIs
StatePublished - 2011
Event2011 IEEE International Vacuum Electronics Conference, IVEC-2011 - Bangalore, India
Duration: Feb 21 2011Feb 24 2011

Publication series

Name2011 IEEE International Vacuum Electronics Conference, IVEC-2011

Conference

Conference2011 IEEE International Vacuum Electronics Conference, IVEC-2011
Country/TerritoryIndia
CityBangalore
Period2/21/112/24/11

Keywords

  • brazing
  • dispenser cathode
  • filler metal
  • nano-composite
  • tungsten

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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