Hybrid assemblies

Janet K. Lumpp

doi:10.1201/9781420049848

Hybrid assemblies

Janet K. Lumpp

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

Abstract

Functional Materials A wide variety of functional materials are available for each category of inks.2 Dielectric inks, for example, include capacitor materials with high dielectric constants, low dielectric constant insulator layers, and low melting point sealing glasses. Resistor inks are the most homogenous group based primarily on ruthenium dioxide as the functional material. Conductors serve the widest range of functions within the circuit; however, it is desirable to print the fewest number of layers, so compromises must be made in choosing an alloy to satisfy all the demands on the conductor layers. Interconnection is the overall purpose of the conductor films and in this role the film must also function as a resistor, capacitor, or inductor termination, wire bond pad, component lead pad, die bond pad, and via fill. Each of these applications has distinct requirements for adhesion and continuity with solder, gold wire, aluminum wire, conductive adhesive, and other thick film layer.

Original language	English
Title of host publication	The Electronic Packaging Handbook
ISBN (Electronic)	9781420049848
DOIs	https://doi.org/10.1201/9781420049848
State	Published - Jan 1 2017

Bibliographical note

Funding Information:
The author would like to thank first of all the pioneers of FPR with whom he has had the pleasure, both personal and intellectual, of interacting over the years: Drs. Watt W. Webb, Michael Edidin, Elliot Elson, Kenneth Jacobson, Reiner Peters, Dan Axelrod, Dennis Koppel, and Yossie abba David Schlessinger. I would also like to thank the members of my own laboratory who have contributed to this chapter: Drs. Valerie Maynard and Richard Cardullo, Ms. Margaret Moynihan McManus, Ms. Christine McKinnon, Mr. Carlos Flores, and Mr. Robert Mungovan. I am also enormously grateful to the technical staff of the Worcester Foundation who have made instrument design such a pleasure: Mr. Walter Zydlewski, Mr. David Bernklow, Mr. Richard Cassidy, and Mr. Richard Barthelmas. This work was supported in part by NIH Grants HD 17377 and HD 23294 and by private grants from the A. W. Mellon Foundation and Educational Foundation of America to the Worchester Foundation.

Publisher Copyright:
© 2000 by CRC Press LLC. All rights reserved.

ASJC Scopus subject areas

Engineering (all)

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10.1201/9781420049848

Cite this

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abstract = "Functional Materials A wide variety of functional materials are available for each category of inks.2 Dielectric inks, for example, include capacitor materials with high dielectric constants, low dielectric constant insulator layers, and low melting point sealing glasses. Resistor inks are the most homogenous group based primarily on ruthenium dioxide as the functional material. Conductors serve the widest range of functions within the circuit; however, it is desirable to print the fewest number of layers, so compromises must be made in choosing an alloy to satisfy all the demands on the conductor layers. Interconnection is the overall purpose of the conductor films and in this role the film must also function as a resistor, capacitor, or inductor termination, wire bond pad, component lead pad, die bond pad, and via fill. Each of these applications has distinct requirements for adhesion and continuity with solder, gold wire, aluminum wire, conductive adhesive, and other thick film layer.",

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note = "Funding Information: The author would like to thank first of all the pioneers of FPR with whom he has had the pleasure, both personal and intellectual, of interacting over the years: Drs. Watt W. Webb, Michael Edidin, Elliot Elson, Kenneth Jacobson, Reiner Peters, Dan Axelrod, Dennis Koppel, and Yossie abba David Schlessinger. I would also like to thank the members of my own laboratory who have contributed to this chapter: Drs. Valerie Maynard and Richard Cardullo, Ms. Margaret Moynihan McManus, Ms. Christine McKinnon, Mr. Carlos Flores, and Mr. Robert Mungovan. I am also enormously grateful to the technical staff of the Worcester Foundation who have made instrument design such a pleasure: Mr. Walter Zydlewski, Mr. David Bernklow, Mr. Richard Cassidy, and Mr. Richard Barthelmas. This work was supported in part by NIH Grants HD 17377 and HD 23294 and by private grants from the A. W. Mellon Foundation and Educational Foundation of America to the Worchester Foundation. Publisher Copyright: {\textcopyright} 2000 by CRC Press LLC. All rights reserved.",

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Hybrid assemblies

Abstract

Bibliographical note

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