Abstract
The creep behavior of Sn3.5Ag eutectic alloy was investigated by using impression technique in the temperature range of 333-453 K and under the punching stress range of 3.4-67.1 MPa. Using a power law between the steady-state impression velocity and the punching stress, it was found the activation energy increases with the punching stress from 44.7 kJ/mol at 6.7 MPa to 79.2 kJ/mol at 46.9 MPa and the stress exponent changes from 1.03 (3.4-13.4 MPa) to 5.9 (20.1-40.2 MPa). However, by using a hyperbolic sine function between the steady-state impression velocity and the punching stress, a single activation energy was found to be 51.0 kJ/mol, which is close to the activation energy for grain boundary diffusion in pure Sn. This suggests that a single mechanism of grain boundary fluid flow is likely the controlling mechanism for the time-dependent plastic flow of Sn3.5Ag eutectic alloy under the testing conditions.
Original language | English |
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Pages (from-to) | 87-92 |
Number of pages | 6 |
Journal | Materials Science and Engineering: A |
Volume | 409 |
Issue number | 1-2 |
DOIs | |
State | Published - Nov 15 2005 |
Bibliographical note
Funding Information:This research is supported by NSF through a grant DMR-0211706 monitored by Drs. Guebre Tessema and Bruce A. MacDonald.
Keywords
- Activation energy
- Constitutive relation
- Eutectic alloy
- Plastic flow
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering