Improved trans-endothelial Electrical Resistance sensing using microfluidic low-temperature co-fired ceramics

William L. Mercke, Thomas Dziubla, Richard E. Eitel, Kimberly Anderson

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Trans-endothelial Electrical Resistance (TEER) and cellular impedance measurements are widely used to evaluate the barrier properties and functional change of endothelial cell monolayers. In the current work, low temperature cofired ceramics (LTCC) are applied enabling the incorporation of TEER and impediametric measurements in an integrated microfluidic chip. LTCC materials are an ideal substrate for biomedical and cell-based microfluidics due to their biocompatibility and ability to combine complex three dimensional structures with optical, fluidic, and electrical functionality. Multilayer microfluidic ceramic devices incorporating gold measurement electrodes where prepared using standard LTCC manufacturing procedures. The sensitivity of the resulting LTCC devices were compared to systems currently on the market for TEER measurements. These results indicate the LTCC device is able to effectively detect the growth of an endothelial cell monolayer. Results further evaluate endothelial cell viability using electrical resistance and Live/Dead assay. Finally, the results from this study also display improved sensitivity through the optimization of the electrode geometry and use of a lock-in amplifier. These results provide a solid basis for using low temperature co-fired ceramic materials for microfluidic TEER devices.

Original languageEnglish
Title of host publication9th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2013
Pages162-167
Number of pages6
StatePublished - 2013
Event9th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2013 - Orlando, FL, United States
Duration: Apr 23 2013Apr 25 2013

Publication series

Name9th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2013

Conference

Conference9th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2013
Country/TerritoryUnited States
CityOrlando, FL
Period4/23/134/25/13

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering

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