Improving the solution accuracy of thin dielectric approximation with a vertical electric field component

The traditional thin dielectric sheet approximation (TDS) method models the electromagnetic scattering by thin dielectric sheet using surface integral equation. In this approximation, only the tangential current within the dielectric sheet is considered, and the vertical component is ignored. This article proposes a method that uses the volume integral equation solution to predict the vertical volume current and hence to improve the overall solution accuracy. The formulation is based on the hybrid surface (SIE) and volume integration equation (VIE) in which, the thin dielectric is modeled with SIE, and the thin layers are modeled by VIE. It is shown that the inclusion of the vertical current component does not increase memory and solution time. Numerical examples will be provided to demonstrate the effectiveness of this approach.