Abstract
Cu thin films with Ta or Ag interlayers exhibited similar stress amplitudes during thermal cycling. However, the Ta interlayer, which was expected to enhance Cu adhesion, led to significantly higher 500 °C stresses than did Ag. Interlayer stress, which was substantial for Ta, was subtracted to calculate true Cu stresses.
Original language | English |
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Pages (from-to) | 733-737 |
Number of pages | 5 |
Journal | Scripta Materialia |
Volume | 50 |
Issue number | 6 |
DOIs | |
State | Published - Mar 2004 |
Bibliographical note
Funding Information:This work was supported by the Deutsche Forschungsgemeinschaft (DFG Grant De 796/5-3). We would like to thank Matthew Turnbull, Frank Thiele and Marc Nikolussi for their assistance in film deposition.
Keywords
- Copper
- Interlayers
- Mechanical properties
- Multilayers
- Thin Films
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys