Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

T. K. Schmidt, T. J. Balk, G. Dehm, E. Arzt

Research output: Contribution to journalArticlepeer-review

18 Scopus citations

Abstract

Cu thin films with Ta or Ag interlayers exhibited similar stress amplitudes during thermal cycling. However, the Ta interlayer, which was expected to enhance Cu adhesion, led to significantly higher 500 °C stresses than did Ag. Interlayer stress, which was substantial for Ta, was subtracted to calculate true Cu stresses.

Original languageEnglish
Pages (from-to)733-737
Number of pages5
JournalScripta Materialia
Volume50
Issue number6
DOIs
StatePublished - Mar 2004

Bibliographical note

Funding Information:
This work was supported by the Deutsche Forschungsgemeinschaft (DFG Grant De 796/5-3). We would like to thank Matthew Turnbull, Frank Thiele and Marc Nikolussi for their assistance in film deposition.

Keywords

  • Copper
  • Interlayers
  • Mechanical properties
  • Multilayers
  • Thin Films

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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