Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

T. K. Schmidt; T. J. Balk; G. Dehm; E. Arzt

doi:10.1016/j.scriptamat.2003.11.039

Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

T. K. Schmidt
, T. J. Balk
, G. Dehm
, E. Arzt

Research output: Contribution to journal › Article › peer-review

19 Scopus citations

Abstract

Cu thin films with Ta or Ag interlayers exhibited similar stress amplitudes during thermal cycling. However, the Ta interlayer, which was expected to enhance Cu adhesion, led to significantly higher 500 °C stresses than did Ag. Interlayer stress, which was substantial for Ta, was subtracted to calculate true Cu stresses.

Original language	English
Pages (from-to)	733-737
Number of pages	5
Journal	Scripta Materialia
Volume	50
Issue number	6
DOIs	https://doi.org/10.1016/j.scriptamat.2003.11.039
State	Published - Mar 2004

Bibliographical note

Funding Information:
This work was supported by the Deutsche Forschungsgemeinschaft (DFG Grant De 796/5-3). We would like to thank Matthew Turnbull, Frank Thiele and Marc Nikolussi for their assistance in film deposition.

Funding

This work was supported by the Deutsche Forschungsgemeinschaft (DFG Grant De 796/5-3). We would like to thank Matthew Turnbull, Frank Thiele and Marc Nikolussi for their assistance in film deposition.

Funders	Funder number
Deutsche Forschungsgemeinschaft	De 796/5-3

Keywords

Copper
Interlayers
Mechanical properties
Multilayers
Thin Films

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

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10.1016/j.scriptamat.2003.11.039

Cite this

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abstract = "Cu thin films with Ta or Ag interlayers exhibited similar stress amplitudes during thermal cycling. However, the Ta interlayer, which was expected to enhance Cu adhesion, led to significantly higher 500 °C stresses than did Ag. Interlayer stress, which was substantial for Ta, was subtracted to calculate true Cu stresses.",

keywords = "Copper, Interlayers, Mechanical properties, Multilayers, Thin Films",

author = "Schmidt, \{T. K.\} and Balk, \{T. J.\} and G. Dehm and E. Arzt",

note = "Funding Information: This work was supported by the Deutsche Forschungsgemeinschaft (DFG Grant De 796/5-3). We would like to thank Matthew Turnbull, Frank Thiele and Marc Nikolussi for their assistance in film deposition.",

year = "2004",

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doi = "10.1016/j.scriptamat.2003.11.039",

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T1 - Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

AU - Schmidt, T. K.

AU - Balk, T. J.

AU - Dehm, G.

AU - Arzt, E.

N1 - Funding Information: This work was supported by the Deutsche Forschungsgemeinschaft (DFG Grant De 796/5-3). We would like to thank Matthew Turnbull, Frank Thiele and Marc Nikolussi for their assistance in film deposition.

PY - 2004/3

Y1 - 2004/3

N2 - Cu thin films with Ta or Ag interlayers exhibited similar stress amplitudes during thermal cycling. However, the Ta interlayer, which was expected to enhance Cu adhesion, led to significantly higher 500 °C stresses than did Ag. Interlayer stress, which was substantial for Ta, was subtracted to calculate true Cu stresses.

AB - Cu thin films with Ta or Ag interlayers exhibited similar stress amplitudes during thermal cycling. However, the Ta interlayer, which was expected to enhance Cu adhesion, led to significantly higher 500 °C stresses than did Ag. Interlayer stress, which was substantial for Ta, was subtracted to calculate true Cu stresses.

KW - Copper

KW - Interlayers

KW - Mechanical properties

KW - Multilayers

KW - Thin Films

UR - https://www.scopus.com/pages/publications/0346499164

UR - https://www.scopus.com/pages/publications/0346499164#tab=citedBy

U2 - 10.1016/j.scriptamat.2003.11.039

DO - 10.1016/j.scriptamat.2003.11.039

M3 - Article

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VL - 50

SP - 733

EP - 737

JO - Scripta Materialia

JF - Scripta Materialia

IS - 6

ER -

Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

Abstract

Bibliographical note

Funding

Keywords

ASJC Scopus subject areas

Access to Document

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