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Interfacial adhesion of photodefinable polyimide films on passivated silicon
Martha E. Grady
, Philippe H. Geubelle
, Nancy R. Sottos
Mechanical and Aerospace Engineering
Biomedical Engineering
Materials Science Research Priority Initiative
Research output
:
Contribution to journal
›
Article
›
peer-review
37
Scopus citations
Overview
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Engineering
Cure Cycle
75%
Delamination
50%
Dielectrics
25%
Fracture Testing
25%
Integrated Circuit
25%
Interfacial Adhesion
100%
Interfacial Fracture Energy
50%
Microsystem
25%
Nitride
50%
Passivation Layer
100%
Silicon Dioxide
25%
Silicon Oxide
25%
Silicon Substrate
25%
Surface Film
25%
Surface Layers
25%
Thin Films
25%
Ultimate Tensile Strength
25%
Material Science
Delamination
33%
Dielectric Material
16%
Electronic Circuit
16%
Film
100%
Materials Property
16%
Nitride Compound
16%
Oxide Compound
16%
Oxynitride
16%
Polyimide
100%
Silicon
100%
Silicon Nitride
16%
Surface (Surface Science)
16%
Thin Films
16%
Ultimate Tensile Strength
16%