Laser machining and metallization of vias in aluminum nitride

Sudhakar Raman, Janet K. Lumpp

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

A via metallization technique involving excimer laser ablation of aluminum nitride substrate with a metal backing, attached with cyanoacrylate adhesive was investigated. The objective was to develop a procedure to ensure good electrical interconnection between the thick film conductor pads and the walls of the via. An aluminum nitride compatible Ag-Pd thick film paste was used in this experiment. Two different sequences were tested: In the first sequence both sides of the aluminum nitride substrate were printed and fired and then the vias were laser drilled. In the second sequence, one side of the substrate was printed and fired first, then the vias were laser drilled and the second side was printed and fired. In both of the above sequences, laser ablation of the printed conductor and redeposition of the ablated metal backing are necessary for making a proper contact with the thick film conductor pads.

Original languageEnglish
Pages (from-to)269-274
Number of pages6
JournalMaterials Research Society Symposium Proceedings
Volume390
DOIs
StatePublished - 1995
EventProceedings of the Spring Meeting on MRS - San Francisco, CA, USA
Duration: Apr 17 1995Apr 20 1995

ASJC Scopus subject areas

  • Materials Science (all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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