Local thermal measurements of impinging liquid jets with an angled confining wall for power electronics cooling

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

The local surface temperature, heat flux, heat transfer coefficient, and Nusselt number were measured for an inline array of circular, normal jets of single-phase, liquid water impinging on a copper block with a common outlet for spent flow, and an experimental 2-D surface map was obtained by translating the jet array relative to the sensors. The effects of variation in jet height, jet pitch, confining wall angle, and average jet Reynolds number were investigated. A strong interaction between the effects of the geometric parameters was observed, and a 5 confining wall was seen to be an effective method of managing the spent flow for jet impingement cooling of power electronics. The maximum average heat transfer coefficient of 13,100W=m2K and average Nusselt number of 67.7 were measured at an average jet Reynolds number of 14,000.

Original languageEnglish
Title of host publicationAdvanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays
ISBN (Electronic)9780791856901
DOIs
StatePublished - 2015
EventASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, United States
Duration: Jul 6 2015Jul 9 2015

Publication series

NameASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Volume3

Conference

ConferenceASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Country/TerritoryUnited States
CitySan Francisco
Period7/6/157/9/15

ASJC Scopus subject areas

  • Process Chemistry and Technology

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