Long-term evaluation of a non-hermetic micropackage technology for MEMS-based, implantable pressure sensors

P. Wang, S. J.A. Majerus, R. Karam, B. Hanzlicek, D. L. Lin, H. Zhu, J. M. Anderson, M. S. Damaser, C. A. Zorman, W. H. Ko

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

13 Scopus citations

Abstract

This paper reports long-term evaluation of a micropackage technology for an implantable MEMS pressure sensor. The all-polymer micropackage survived > 160 days when subjected to accelerated lifetime testing at 85°C in a 1% wt. saline solution. The package exhibited minimum impact on sensitivity and linearity, which deviated by less than 5% and 0.3%, respectively. A 6-month in vivo evaluation of 16 MEMS-based pressure sensors showed that the micropackage exhibits good biocompatibility and provides excellent protection. To the best of our knowledge, these results establish new lifetime records for devices packaged using an all-polymer micropackaging approach.

Original languageEnglish
Title of host publication2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
Pages484-487
Number of pages4
ISBN (Electronic)9781479989553
DOIs
StatePublished - Aug 5 2015
Event18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
Duration: Jun 21 2015Jun 25 2015

Publication series

Name2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015

Conference

Conference18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
Country/TerritoryUnited States
CityAnchorage
Period6/21/156/25/15

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

Keywords

  • Non-hermetic micropackage
  • PDMS
  • Parylene-C
  • biocompatibility
  • encapsulation
  • packaging
  • pressure sensor

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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