Mechanical behavior and microstructure of nanoporous gold films

Ye Sun; T. John Balk

doi:10.1557/proc-0924-z01-02

Mechanical behavior and microstructure of nanoporous gold films

Ye Sun, T. John Balk

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

Nanoporous gold (NPG) thin films offer an opportunity to investigate the effects of nanoscale geometric confinement on the mechanical properties of metals. In the present study, NPG films supported by substrates were fabricated by dealloying Au-Ag films on Kapton and silicon. The microstructural evolution of NPG at various stages of dealloying was observed and analyzed by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Cracking occurred at grain boundaries during dealloying and may be exacerbated by pre-existing tensile stress in the film. Stress evolution of NPG films on silicon substrates during dealloying was measured with the wafer curvature technique and revealed an overall shift toward compressive stress.

Original language	English
Title of host publication	Mechanics of Nanoscale Materials and Devices
Pages	1-6
Number of pages	6
DOIs	https://doi.org/10.1557/proc-0924-z01-02
State	Published - 2006
Event	2006 MRS Spring Meeting - San Francisco, CA, United States Duration: Apr 17 2006 → Apr 21 2006

Publication series

Name	Materials Research Society Symposium Proceedings
Volume	924
ISSN (Print)	0272-9172

Conference

Conference	2006 MRS Spring Meeting
Country/Territory	United States
City	San Francisco, CA
Period	4/17/06 → 4/21/06

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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title = "Mechanical behavior and microstructure of nanoporous gold films",

abstract = "Nanoporous gold (NPG) thin films offer an opportunity to investigate the effects of nanoscale geometric confinement on the mechanical properties of metals. In the present study, NPG films supported by substrates were fabricated by dealloying Au-Ag films on Kapton and silicon. The microstructural evolution of NPG at various stages of dealloying was observed and analyzed by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Cracking occurred at grain boundaries during dealloying and may be exacerbated by pre-existing tensile stress in the film. Stress evolution of NPG films on silicon substrates during dealloying was measured with the wafer curvature technique and revealed an overall shift toward compressive stress.",

author = "Ye Sun and {John Balk}, T.",

year = "2006",

doi = "10.1557/proc-0924-z01-02",

language = "English",

isbn = "1558998810",

series = "Materials Research Society Symposium Proceedings",

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T1 - Mechanical behavior and microstructure of nanoporous gold films

AU - Sun, Ye

AU - John Balk, T.

PY - 2006

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N2 - Nanoporous gold (NPG) thin films offer an opportunity to investigate the effects of nanoscale geometric confinement on the mechanical properties of metals. In the present study, NPG films supported by substrates were fabricated by dealloying Au-Ag films on Kapton and silicon. The microstructural evolution of NPG at various stages of dealloying was observed and analyzed by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Cracking occurred at grain boundaries during dealloying and may be exacerbated by pre-existing tensile stress in the film. Stress evolution of NPG films on silicon substrates during dealloying was measured with the wafer curvature technique and revealed an overall shift toward compressive stress.

AB - Nanoporous gold (NPG) thin films offer an opportunity to investigate the effects of nanoscale geometric confinement on the mechanical properties of metals. In the present study, NPG films supported by substrates were fabricated by dealloying Au-Ag films on Kapton and silicon. The microstructural evolution of NPG at various stages of dealloying was observed and analyzed by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Cracking occurred at grain boundaries during dealloying and may be exacerbated by pre-existing tensile stress in the film. Stress evolution of NPG films on silicon substrates during dealloying was measured with the wafer curvature technique and revealed an overall shift toward compressive stress.

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U2 - 10.1557/proc-0924-z01-02

DO - 10.1557/proc-0924-z01-02

M3 - Conference contribution

AN - SCOPUS:33947646775

SN - 1558998810

SN - 9781558998810

T3 - Materials Research Society Symposium Proceedings

SP - 1

EP - 6

BT - Mechanics of Nanoscale Materials and Devices

T2 - 2006 MRS Spring Meeting

Y2 - 17 April 2006 through 21 April 2006

ER -

Mechanical behavior and microstructure of nanoporous gold films

Abstract

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